JGN1105H-TR
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Soldering condition
1. Heat stress during soldering will influence the reliability of LEDs, however that effect will vary on heating
method. Also, if components of varying shape are soldered together, it is recommended to set the soldering
pad temperature according to the component most vulnerable to heat (e.g., surface mount LED).
2. LED parts including the resin are not stable immediately after soldering ( when they are not at room
temperature), any mechanical stress may cause damage to the product. Please avoid such stress after
soldering, especially stacking of the boards which may cause the boards to warp and any other types of
friction with hard materials.
3. Recommended temperature profile for the Reflow soldering is listed as the temperature of the resin surface.
Temperature distribution varies on heating method, PCB material, other components in the assembly, and
mounting density.
Please do not repeat the heating process in Reflow process more than twice.
Note 1 Recommended temperature profile for the reflow soldering is listed as the temperature of the resin surface.
This should be the maximum temperature for soldering. Lowering the heating temperature and decreasing heating
time is very effective in achieving higher reliability.
Note 2 The reflow soldering process should be done up to twice(2 times Max). When second process is
performed, interval between first and second process should be as short as possible to prevent absorption of
moisture to resin of LED. The second soldering process should not be done until LEDs have returned to room
temperature (by nature-cooling) after first soldering process.
【Soldering Precaution】
(acc.to EIAJ-4701/300)
【Recommended Reflow Soldering Condition】
40sec MAX.
150℃～180℃
+1.5～+5℃/s
260℃ MAX.
-1.5～-5℃/s
90~120sec MAX.
（Pre-heating）
(Soldering）
230℃ MAX.
Peak Temperature
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2016.11.28
