1:1 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR 13 Rev D 2/17/15
8745B-21 DATA SHEET
Schematic Example
The schematic of the 8745B-21 layout example is shown in Figure
5A. The 8745B-21 recommended PCB board layout for this example
is shown in Figure 5B. This layout example is used as a general
guideline. The layout in the actual system will depend on the selected
component types, the density of the components, the density of the
traces, and the stack up of the P.C. board.
Figure 5A. 8745B-21 LVDS Zero Delay Buffer Schematic Example
SEL2
PLL_SEL
RD6
SP
RD4
SP
R4
100
VDD
RU3
1K
SP = Space (i.e. not intstalled)
SEL0
SEL3
RU4
1K
SEL[3:0] = 0101,
Divide by 2
R8
50
RD7
1K
(77.76 MHz)
VDDO
VDD
C1
0.1uF
Bypass capacitors located
near the power pins
RU5
SP
C16
10u
SEL3
VDDO
(U1-7)
Zo = 50 Ohm
VDDA
3.3V PECL Driver
SEL1
R9
50
VDD=3.3V
VDDO
R10
50
SEL0
Zo = 50 Ohm
RD5
1K
C11
0.01u
(U1-11)
C4
0.1uF
SEL2
(155.52 MHz)
LVDS_input
+
-
Zo = 100 Ohm Differential
R2
100
SEL1
RU7
SP
C2
0.1uF
R7
10
PLL_SEL
U1
ICS8745B-21
1
2
3
4
5
6
7
8
9
10 11
12
13
14
15
16
20
19
18
17
CLK
nCLK
MR
nFB_IN
FB_IN
SEL2
VDDO
nQFB
QFB
GND VDDO
nQ
Q
GND
SEL3
VDDA
SEL1
SEL0
VDDI
PLL_SEL
RD3
SP
VDD
VDDO=3.3V
RU6
1K
3.3V
Rev D 2/17/15 14 1:1 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR
8745B-21 DATA SHEET
The following component footprints are used in this layout example.
All the resistors and capacitors are size 0603.
Power and Grounding
Place the decoupling capacitors as close as possible to the power
pins. If space allows, placement of the decoupling capacitor on the
component side is preferred. This can reduce unwanted inductance
between the decoupling capacitor and the power pin caused by the
via.
Maximize the power and ground pad sizes and number of vias
capacitors. This can reduce the inductance between the power and
ground planes and the component power and ground pins.
The RC filter consisting of R7, C11, and C16 should be placed as
close to the V
DDA
pin as possible.
Clock Traces and Termination
Poor signal integrity can degrade the system performance or cause
system failure. In synchronous high-speed digital systems, the clock
signal is less tolerant to poor signal integrity than other signals. Any
ringing on the rising or falling edge or excessive ring back can cause
system failure. The shape of the trace and the trace delay might be
restricted by the available space on the board and the component
location. While routing the traces, the clock signal traces should be
routed first and should be locked prior to routing other signal traces.
The differential 50 output traces should have the same length.
Avoid sharp angles on the clock trace. Sharp angle turns cause
the characteristic impedance to change on the transmission
lines.
Keep the clock traces on the same layer. Whenever
possible, avoid placing vias on the clock traces.
Placement of vias on the traces can affect the trace
characteristic impedance and hence degrade signal
integrity.
To prevent cross talk, avoid routing other signal traces in
parallel with the clock traces. If running parallel traces is
unavoidable, allow a separation of at least three trace
widths between the differential clock trace and the other
signal trace.
Make sure no other signal traces are routed between the clock
trace pair.
The matching termination resistors should be located as close
to the receiver input pins as possible.
Figure 5B. PCB Board Layout for 8745B-21
100 Ohm
Differential
Traces
VDDA
VDD
C2
U1
R7
C16
VDDO
GND
C4
C1
ICS8745B-21
VIA
C11
1:1 DIFFERENTIAL-TO-LVDS ZERO DELAY CLOCK GENERATOR 15 Rev D 2/17/15
8745B-21 DATA SHEET
Power Considerations
This section provides information on power dissipation and junction temperature for the 8745B-21.
Equations and example calculations are also provided.
1. Power Dissipation.
The total power dissipation for the 8745B-21 is the sum of the core power plus the analog power plus the power dissipated in the load(s).
The following is the power dissipation for V
DD
= 3.3V + 5% = 3.465V, which gives worst case results.
NOTE: Please refer to Section 3 for details on calculating power dissipated in the load.
Power (core)
MAX
= V
DD_MAX
* (I
DD_MAX
+ I
DDA_MAX
) = 3.465V * (125mA + 17mA) = 492mW
Power (outputs)
MAX
= V
DDO_MAX
* I
DDO_MAX
= 3.465V * 59mA = 204mW
Total Power_
MAX
= 492mW + 204mW = 696mW
2. Junction Temperature.
Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad directly affects the reliability of the device. The
maximum recommended junction temperature is 125°C. Limiting the internal transistor junction temperature, Tj, to 125°C ensures that the bond
wire and bond pad temperature remains below 125°C.
The equation for Tj is as follows: Tj =
JA
* Pd_total + T
A
Tj = Junction Temperature
JA
= Junction-to-Ambient Thermal Resistance
Pd_total = Total Device Power Dissipation (example calculation is in section 1 above)
T
A
= Ambient Temperature
In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance
JA
must be used. Assuming a moderate air
flow of 200 linear feet per minute and a multi-layer board, the appropriate value is 39.7°C/W per Table 7below.
Therefore, Tj for an ambient temperature of 70°C with all outputs switching is:
70°C + 0.696W * 39.7°C/W = 97.6°C. This is well below the limit of 125°C.
This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of
board (multi-layer).
Table 7. Thermal Resistance
JA
for 20 Lead SOIC, Forced Convection
JA
vs. Air Flow
Linear Feet per Minute 0 200 500
Single-Layer PCB, JEDEC Standard Test Boards 83.2°C/W 65.7°C/W 57.5°C/W
Multi-Layer PCB, JEDEC Standard Test Boards 46.2°C/W 39.7°C/W 36.8°C/W
NOTE: Most modern PCB designs use multi-layered boards. The data in the second row pertains to most designs.

8745BM-21LFT

Mfr. #:
Manufacturer:
IDT
Description:
Clock Generators & Support Products Differential to LVDS Zero Delay Clock Ge
Lifecycle:
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