IXTK550N055T2

© 2009 IXYS CORPORATION, All Rights Reserved
Symbol Test Conditions Maximum Ratings
V
DSS
T
J
= 25°C to 175°C55V
V
DGR
T
J
= 25°C to 175°C, R
GS
= 1MΩ 55 V
V
GSS
Continuous ± 20 V
V
GSM
Transient ± 30 V
I
D25
T
C
= 25°C (Chip Capability) 550 A
I
L(RMS)
External Lead Current Limit 160 A
I
DM
T
C
= 25°C, Pulse Width Limited by T
JM
1375 A
I
A
T
C
= 25°C 200 A
E
AS
T
C
= 25°C3J
P
D
T
C
= 25°C 1250 W
T
J
-55 ... +175 °C
T
JM
175 °C
T
stg
-55 ... +175 °C
T
L
1.6mm (0.062 in.) from Case for 10s 300 °C
T
SOLD
Plastic Body for 10s 260 °C
M
d
Mounting Torque (TO-264) 1.13/10 Nm/lb.in.
F
C
Mounting Force (PLUS247) 20..120 /4.5..27 N/lb.
Weight TO-264 10 g
PLUS247 6 g
Symbol Test Conditions Characteristic Values
(T
J
= 25°C Unless Otherwise Specified) Min. Typ. Max.
BV
DSS
V
GS
= 0V, I
D
= 250μA 55 V
V
GS(th)
V
DS
= V
GS
, I
D
= 250μA 2.0 4.0 V
I
GSS
V
GS
= ± 20V, V
DS
= 0V ± 200 nA
I
DSS
V
DS
= V
DSS
, V
GS
= 0V 10 μA
T
J
= 150°C 1 mA
R
DS(on)
V
GS
= 10V, I
D
= 100A, Notes 1 & 2 1.6 mΩ
N-Channel Enhancement Mode
Avalanche Rated
Fast Intrinsic Diode
IXTK550N055T2
IXTX550N055T2
V
DSS
= 55V
I
D25
= 550A
R
DS(on)
1.6m
ΩΩ
ΩΩ
Ω
DS100217(11/09)
Features
z
International Standard Packages
z
High Current Handling Capability
z
Fast Intrinsic Diode
z
Avalanche Rated
z
Low R
DS(on)
Advantages
z
Easy to Mount
z
Space Savings
z
High Power Density
Applications
z
DC-DC Converters and Off-Line UPS
z
Primary-Side Switch
z
High Speed Power Switching
Applications
TrenchT2
TM
GigaMOS
TM
Power MOSFET
Advance Technical Information
G = Gate D = Drain
S = Source Tab = Drain
PLUS247 (IXTX)
TO-264 (IXTK)
S
G
D
Tab
Tab
G
S
D
IXYS Reserves the Right to Change Limits, Test Conditions, and Dimensions.
IXTK550N055T2
IXTX550N055T2
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,850,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
ADVANCE TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from a subjective evaluation of the design, based upon prior knowledge and experience, and constitute a
"considered reflection" of the anticipated result. IXYS reserves the right to change limits, test
conditions, and dimensions without notice.
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, Unless Otherwise Specified) Min. Typ. Max.
g
fs
V
DS
= 10V, I
D
= 60A, Note 1 90 150 S
C
iss
40 nF
C
oss
V
GS
= 0V, V
DS
= 25V, f = 1MHz 4970 pF
C
rss
1020 pF
R
GI
Gate Input Resistance 1.36 Ω
t
d(on)
45 ns
t
r
40 ns
t
d(off)
90 ns
t
f
230 ns
Q
g(on)
595 nC
Q
gs
V
GS
= 10V, V
DS
= 0.5 • V
DSS
, I
D
= 0.5 • I
DSS
150 nC
Q
gd
163 nC
R
thJC
0.12 °C/W
R
thCS
0.15 °C/W
Source-Drain Diode
Symbol Test Conditions Characteristic Values
(T
J
= 25°C, Unless Otherwise Specified) Min. Typ. Max.
I
S
V
GS
= 0V 550 A
I
SM
Repetitive, Pulse Width Limited by T
JM
1700 A
V
SD
I
F
= 100A, V
GS
= 0V, Note 1 1.2 V
t
rr
100 ns
I
RM
5 A
Q
RM
250 nC
Resistive Switching Times
V
GS
= 10V, V
DS
= 0.5 • V
DSS
, I
D
= 200A
R
G
= 1Ω (External)
I
F
= 100A, V
GS
= 0V
-di/dt = 100A/μs
V
R
= 27.5V
Notes: 1. Pulse test, t 300μs, duty cycle, d 2%.
2. Includes lead resistance.
TO-264 (IXTK) Outline
Millimeter Inches
Min. Max. Min. Max.
A 4.82 5.13 .190 .202
A1 2.54 2.89 .100 .114
A2 2.00 2.10 .079 .083
b 1.12 1.42 .044 .056
b1 2.39 2.69 .094 .106
b2 2.90 3.09 .114 .122
c 0.53 0.83 .021 .033
D 25.91 26.16 1.020 1.030
E 19.81 19.96 .780 .786
e 5.46 BSC .215 BSC
J 0.00 0.25 .000 .010
K 0.00 0.25 .000 .010
L 20.32 20.83 .800 .820
L1 2.29 2.59 .090 .102
P 3.17 3.66 .125 .144
Q 6.07 6.27 .239 .247
Q1 8.38 8.69 .330 .342
R 3.81 4.32 .150 .170
R1 1.78 2.29 .070 .090
S 6.04 6.30 .238 .248
T 1.57 1.83 .062 .072
Dim.
Terminals: 1 - Gate
2 - Drain (Collector)
3 - Source (Emitter)
4 - Drain (Collector)
PLUS 247
TM
(IXTX) Outline
Dim. Millimeter Inches
Min. Max. Min. Max.
A 4.83 5.21 .190 .205
A
1
2.29 2.54 .090 .100
A
2
1.91 2.16 .075 .085
b 1.14 1.40 .045 .055
b
1
1.91 2.13 .075 .084
b
2
2.92 3.12 .115 .123
C 0.61 0.80 .024 .031
D 20.80 21.34 .819 .840
E 15.75 16.13 .620 .635
e 5.45 BSC .215 BSC
L 19.81 20.32 .780 .800
L1 3.81 4.32 .150 .170
Q 5.59 6.20 .220 0.244
R 4.32 4.83 .170 .190
© 2009 IXYS CORPORATION, All Rights Reserved
IXTK550N055T2
IXTX550N055T2
Fig. 1. Output Characteristics @ T
J
= 25ºC
0
50
100
150
200
250
300
350
0.0 0.1 0.2 0.3 0.4 0.5
V
DS
- Volts
I
D
- Amperes
V
GS
= 15V
10V
8V
4V
7V
5V
6V
Fig. 3. Output Characteristics @ T
J
= 150ºC
0
50
100
150
200
250
300
350
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0
V
DS
- Volts
I
D
- Amperes
V
GS
= 15V
10V
8V
7V
5
V
6
V
4V
Fig. 4. Normalized R
DS(on)
vs. Junction Temperature
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
-50 -25 0 25 50 75 100 125 150 175
T
J
- Degrees Centigrade
R
DS(on)
- Normalized
V
GS
= 10V
I
D
< 550A
Fig. 5. Normalized R
DS(on)
vs. Drain Current
0.8
1.0
1.2
1.4
1.6
1.8
2.0
0 50 100 150 200 250 300 350 400
I
D
- Amperes
R
DS(on)
- Normalized
V
GS
= 10V
15V
T
J
= 175ºC
T
J
= 25ºC
Fig. 6. Drain Current vs. Case Temperature
0
20
40
60
80
100
120
140
160
180
-50 -25 0 25 50 75 100 125 150 175
T
C
- Degrees Centigrade
I
D
- Amperes
External Lead Current Limit
Fig. 2. Extended Output Characteristics @ T
J
= 25ºC
0
50
100
150
200
250
300
350
400
0.0 0.5 1.0 1.5 2.0 2.5
V
DS
- Volts
I
D
- Amperes
V
GS
= 15V
4V
5V
10V
8V
7V
6V

IXTK550N055T2

Mfr. #:
Manufacturer:
Description:
Gate Drivers GigaMOS Trench T2 HiperFET PWR MOSFET
Lifecycle:
New from this manufacturer.
Delivery:
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