BF861A_BF861B_BF861C All information provided in this document is subject to legal disclaimers. © NXP B.V. 2011. All rights reserved.
Product data sheet Rev. 5 — 15 September 2011 2 of 14
NXP Semiconductors
BF861A; BF861B; BF861C
N-channel junction FETs
2. Pinning information
3. Ordering information
4. Marking
[1] * = p: Made in Hong Kong.
* = t: Made in Malaysia.
* = W: Made in China.
5. Limiting values
[1] Device mounted on an FR4 printed-circuit board.
Table 2. Discrete pinning
Pin Description Simplified outline Symbol
1source
2drain
3gate
Table 3. Ordering information
Type
number
Package
Name Description Version
BF861A - plastic surface mounted package; 3 leads SOT23
BF861B - plastic surface mounted package; 3 leads SOT23
BF861C - plastic surface mounted package; 3 leads SOT23
Table 4. Marking codes
Type number Marking code
[1]
BF861A 28*
BF861B 29*
BF861C 30*
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
DS
drain-source voltage (DC) - 25 V
V
GSO
gate-source voltage open drain - 25 V
V
DGO
drain-gate voltage (DC) open source - 25 V
I
G
forward gate current (DC) - 10 mA
P
tot
total power dissipation up to T
amb
=25C
[1]
-250mW
T
stg
storage temperature 65 +150 C
T
j
operating junction
temperature
-150C