NB100LVEP221MNRG

NB100LVEP221
www.onsemi.com
10
ORDERING INFORMATION
Device Package Shipping
NB100LVEP221FAG LQFP−52
(Pb−Free)
160 Units / Tray
NB100LVEP221FARG LQFP−52
(Pb−Free)
1500 / Tape & Reel
NB100LVEP221MNG QFN−52
(Pb−Free)
260 Units / Tray
NB100LVEP221MNR2G QFN−52
(Pb−Free)
2000 / Tape & Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
Resource Reference of Application Notes
AN1405/D ECL Clock Distribution Techniques
AN1406/D Designing with PECL (ECL at +5.0 V)
AN1503/D
ECLinPSt I/O SPiCE Modeling Kit
AN1504/D Metastability and the ECLinPS Family
AN1568/D Interfacing Between LVDS and ECL
AN1672/D The ECL Translator Guide
AND8001/D Odd Number Counters Design
AND8002/D Marking and Date Codes
AND8020/D Termination of ECL Logic Devices
AND8066/D Interfacing with ECLinPS
AND8090/D AC Characteristics of ECL Devices
NB100LVEP221
www.onsemi.com
11
PACKAGE DIMENSIONS
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MM.
3. DATUM PLANE “E" IS LOCATED AT BOTTOM OF
LEAD AND IS COINCIDENT WITH THE LEAD
WHERE THE LEAD EXITS THE PLASTIC BODY AT
THE BOTTOM OF THE PARTING PLANE.
4. DATUM “X", “Y" AND “Z" TO BE DETERMINED AT
DATUM PLANE DATUM “E".
5. DIMENSIONS M AND L TO BE DETERMINED AT
SEATING PLANE DATUM “T".
6. DIMENSIONS A AND B DO NOT INCLUDE MOLD
PROTRUSION. ALLOWABLE PROTRUSION IS 0.25
(0.010) PER SIDE. DIMENSIONS A AND B DO
INCLUDE MOLD MISMATCH AND ARE
DETERMINED AT DATUM PLAND “E".
7. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL NOT CAUSE THE LEAD
WIDTH TO EXCEED THE MAXIMUM D DIMENSION
BY MORE THAN 0.08 (0.003). DAMBAR CANNOT
BE LOCATED ON THE LOWER RADIUS OR THE
FOOT. MINIMUM SPACE BETWEEN PROTRUSION
AND ADJACENT LEAD OR PROTRUSION 0.07
(0.003).
DIM
A
MIN MAX MIN MAX
INCHES
10.00 BSC 0.394 BSC
MILLIMETERS
B 10.00 BSC 0.394 BSC
C 1.30 1.50 0.051 0.059
D 0.22 0.40 0.009 0.016
F 0.45 0.75 0.018 0.030
G 0.65 BSC 0.026 BSC
H 1.00 REF 0.039 BSC
J 0.09 0.20 0.004 0.008
K 0.05 0.20 0.002 0.008
L 12.00 BSC 0.472 BSC
M 12.00 BSC 0.472 BSC
N 0.20 REF 0.008 REF
P 0 7 0 7
R 0 --- 0 ---
S --- 1.70 --- 0.067
V 12 REF 12 REF
W 12 REF 12 REF
AA 0.20 0.35 0.008 0.014
AB 0.07 0.16 0.003 0.006
AC 0.08 0.20 0.003 0.008
AD 4.58 4.78 0.180 0.188
AE 4.58 4.78 0.180 0.188
_
_
_
_
____
__
−Y−
0.05 (0.002)
S
1
B
B/2
13
14
26
27
39
4052
−X−
L
L/2
−Z−
M
M/2
A
A/2
AJAJ
Z
0.20 (0.008) T X-Y
4 PL
Z0.20 (0.008) E X-Y
−T−
SEATING
PLANE
G
AGAG
D 52 PL
Z0.08 (0.003)
M
T X-Y
−E−
0.10 (0.004) T
1
13
14
26
27
39
4052
EXPOSED PAD
VIEW AG−AG
AD
AE
DETAIL AH
DETAIL AH
AA
D
AB
J
DETAIL AJ−AJ
REF
BASE
METAL
PLATING
Z0.08 (0.003)
M
Y T-U
S
C
K
V
R
W
N
F
H
P
AC
0.25
GAGE
PLANE
48 PL
SCALE 1:1
LQFP 52 EXPOSED PAD
CASE 848H
ISSUE B
SOLDERING FOOTPRINT
DIMENSIONS: MILLIMETERS
12.36
4.80
4.80
0.65
1.18
0.40
52X
52X
PITCH
12.36
PKG
OUTLINE
RECOMMENDED
NB100LVEP221
www.onsemi.com
12
PACKAGE DIMENSIONS
QFN52 8x8, 0.5P
CASE 485M
ISSUE C
C0.15
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. DIMENSION b APPLIES TO PLATED TERMINAL
AND IS MEASURED BETWEEN 0.25 AND 0.30
MM FROM TERMINAL.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A
D
E
B
C0.08
A1
A3
A
D2
L
NOTE 3
C0.15
2X
2X
SEATING PLANE
C0.10
A2
C
E2
52 X
e
1
13
14 26
27
39
4052
b
52 X
A0.10 BC
0.05 C
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A2 0.60 0.80
A3 0.20 REF
b 0.18 0.30
D 8.00 BSC
D2 6.50 6.80
E 8.00 BSC
E2 6.50 6.80
e 0.50 BSC
K 0.20 ---
REF
K
52 X
L 0.30 0.50
PIN ONE
REFERENCE
SOLDERING FOOTPRINT
DIMENSIONS: MILLIMETERS
8.30
6.75
6.75
0.50
0.62
0.30
52X
52X
PITCH
8.30
PKG
OUTLINE
RECOMMENDED
P
UBLICATION ORDERING INFORMATION
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
NB100LVEP221/D
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your loc
al
Sales Representative
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NB100LVEP221MNRG

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
Clock Drivers & Distribution BBG ECL 1:20 DIF HSTL/ECL
Lifecycle:
New from this manufacturer.
Delivery:
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