List of figures M27C4002
4/24
List of figures
Figure 1. Logic Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Figure 2. DIP Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Figure 3. LCC Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 4. TSOP Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Figure 5. Programming Flowchart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Figure 6. AC Testing Input Output Waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 7. AC Testing Load Circuit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Figure 8. Read Mode AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Figure 9. Programming and Verify Modes AC Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Figure 10. FDIP40W - 40 pin Ceramic Frit-seal DIP with window, Package Outline . . . . . . . . . . . . . . 18
Figure 11. PDIP40 - 40 lead Plastic DIP, 600 mils width, Package Outline. . . . . . . . . . . . . . . . . . . . . 19
Figure 12. PLCC44 - 44 lead Plastic Leaded Chip Carrier, Package Outline . . . . . . . . . . . . . . . . . . . 20
Figure 13. TSOP40 - 40 lead Plastic Thin Small Outline, 10 x 20 mm, Package Outline . . . . . . . . . . 21
Obsolete Product(s) - Obsolete Product(s)
M27C4002 Summary description
5/24
1 Summary description
The M27C4002 is a 4 Mbit EPROM offered in the two ranges UV (ultra violet erase) and
OTP (one time programmable). It is ideally suited for microprocessor systems requiring
large programs and is organized as 262,144 words of 16 bits.
The FDIP40W (window ceramic frit-seal package) has transparent lids which allow the user
to expose the chip to ultraviolet light to erase the bit pattern. A new pattern can then be
written to the device by following the programming procedure.
For applications where the content is programmed only one time and erasure is not
required, the M27C4002 is offered in PDIP40, PLCC44 and TSOP40 (10 x 20 mm)
packages.
In order to meet environmental requirements, ST offers the M27C4002 in ECOPACK
®
packages.
ECOPACK packages are Lead-free. The category of second Level Interconnect is marked
on the package and on the inner box label, in compliance with JEDEC Standard JESD97.
The maximum ratings related to soldering conditions are also marked on the inner box label.
ECOPACK is an ST trademark. ECOPACK specifications are available at: www.st.com.
Figure 1. Logic Diagram
AI00727B
18
A0-A17 Q0-Q15
V
PP
V
CC
M27C4002
V
SS
16
G
E
Obsolete Product(s) - Obsolete Product(s)
Summary description M27C4002
6/24
Figure 2. DIP Connections
Table 1. Signal Names
A0-A17 Address Inputs
Q0-Q15 Data Outputs
E
Chip Enable
G
Output Enable
V
PP
Program Supply
V
CC
Supply Voltage
V
SS
Ground
NC Not Connected Internally
Q6
Q5
Q4
Q11
Q8
V
SS
Q7
Q10
Q9
A12
A8
A11
A10
A6
A13
A9
V
SS
A7
A2Q1
Q0
A0G
A1
A5
A16
A17E
Q12
V
PP
V
CC
Q15
AI00728
M27C4002
8
1
2
3
4
5
6
7
9
10
11
12
13
14
15
16
32
31
30
29
28
27
26
25
24
23
22
2120
19
18
17
Q3
Q2
Q14
Q13
A4
A3
40
39
38
37
36
35
34
33
A14
A15
Obsolete Product(s) - Obsolete Product(s)

M27C4002-80C6

Mfr. #:
Manufacturer:
STMicroelectronics
Description:
EPROM 4M (256Kx16) 80ns
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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