Data Sheet ADCLK950
Rev. B | Page 5 of 12
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter Rating
Supply Voltage
V
− V
6 V
Input Voltage
CLK0, CLK1,
CLK0
,
CLK1
, IN_SEL V
EE
− 0.5 V to
V
+ 0.5 V
CLK0, CLK1,
CLK0
,
CLK1
to V
T
x Pin (CML,
LVPECL Termination)
±40 mA
CLK0, CLK1 to
CLK0
,
CLK1
±1.8 V
Input Termination, V
T
x to CLK0, CLK1,
CLK0
,
and
CLK1
±2 V
Maximum Voltage on Output Pins V
+ 0.5 V
Maximum Output Current 35 mA
Voltage Reference (V
x) V
to V
Operating Temperature Range
Ambient −40°C to +85°C
Junction 150°C
Storage Temperature Range −65°C to +150°C
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
DETERMINING JUNCTION TEMPERATURE
To determine the junction temperature on the application
printed circuit board (PCB), use the following equation:
T
J
= T
CASE
+ (Ψ
JT
× P
D
)
where:
T
J
is the junction temperature (°C).
T
CASE
is the case temperature (°C) measured by the customer at
the top center of the package.
Ψ
JT
is from Table 6.
P
D
is the power dissipation.
Values of θ
JA
are provided for package comparison and PCB
design considerations. θ
JA
can be used for a first-order approxi-
mation of T
J
by the equation
T
J
= T
A
+ (
θ
JA
× P
D
)
where T
A
is the ambient temperature (°C).
Values of θ
JB
are provided in Table 6 for package comparison
and PCB design considerations.
ESD CAUTION
THERMAL PERFORMANCE
Table 6.
Parameter Symbol Description Value
1
Unit
Junction-to-Ambient Thermal Resistance
θ
Still Air Per JEDEC JESD51-2
Moving Air
θ
Per JEDEC JESD51-6
1 m/sec Air Flow 40.3 °C/W
2.5 m/sec Air Flow 36.2 °C/W
Junction-to-Board Thermal Resistance
θ
Moving Air Per JEDEC JESD51-8
1 m/sec Air Flow 28.7 °C/W
Junction-to-Case Thermal Resistance
θ
Moving Air Per MIL-STD 883, Method 1012.1
Die-to-Heatsink 8.3 °C/W
Junction-to-Top-of-Package Characterization Parameter
Ψ
Still Air Per JEDEC JESD51-2
0 m/sec Air Flow 0.6 °C/W
1
Results are from simulations. The PCB is a JEDEC multilayer type. Thermal performance for actual applications requires careful inspection of the conditions in the
application to determine if they are similar to those assumed in these calculations.