AD8387
Rev. 0 | Page 5 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter Rating
Supply Voltages
AVCCx − AGNDx 18 V
DVCC − DGND 4.5 V
Input Voltages
Maximum Digital Input Voltage DVCC + 0.5 V
Minimum Digital Input Voltage DGND − 0.5 V
Maximum Analog Input Voltage AVCC + 0.5 V
Minimum Analog Input Voltage AGND − 0.5 V
Internal Power Dissipation
1
TQFP E-Pad @ T
A
= 25°C 4.38 W
Operating Temperature Range 0°C to 85°C
Storage Temperature Range −65°C to +125°C
Lead Temperature Range (Soldering 10 sec) 300°C
1
80-lead TQFP E-Pad:
θ
JA
= 28.5°C/W (still air) [JEDEC Standard, 4-layer PCB in still air]
θ
JC
= 12.2°C/W
θ
JB
= 14.6°C/W
Ψ
JB
= 12.0°C/W
Ψ
JT
= 0.3°C/W.
Stresses above those listed under the Absolute Maximum
Ratings may cause permanent damage to the device. This is a
stress rating only; functional operation of the device at these or
any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to the
absolute maximum ratings for extended periods may reduce
device reliability.
EXPOSED PADDLE
To ensure optimized thermal performance, the exposed paddle
must be thermally connected to an external plane, such as
AVCC or GND, as described in the
Applications section.
OVERLOAD PROTECTION
The AD8387 overload protection circuit consists of an output
current limiter and a thermal switch.
When TSW is LOW, the thermal switch is disabled and the
output current limiter is enabled. The maximum current at any
one output is internally limited to 100 mA average. In the event
of a momentary short-circuit between a video output and a
power supply rail (VCC or AGND), the output current limit is
sufficiently low to provide temporary protection.
When TSW is HIGH, the output current limiter, as well as the
thermal switch, is enabled. The thermal switch debiases the
output amplifier when the junction temperature reaches the
internally set trip point. In the event of an extended short-
circuit between a video output and a power supply rail, the
output amplifier current continues to switch between 0 and
100 mA typical with a period determined by the thermal time
constant and the hysteresis of the thermal trip point. The
thermal switch, when enabled, provides long-term protection
from accidental shorts during the assembly process by limiting
the average junction temperature to a safe level.
MAXIMUM POWER DISSIPATION
The maximum power that the AD8387 can safely dissipate is
limited by its junction temperature. The maximum safe junction
temperature for plastic encapsulated devices, as determined by the
glass transition temperature of the plastic, is approximately 150°C.
Exceeding this limit temporarily can cause a shift in the parametric
performance due to a change in the stresses exerted on the die by
the package. Exceeding a junction temperature of 150°C for an
extended period can result in device failure.
OPERATING TEMPERATURE RANGE
To ensure operation within the specified operating temperature
range, it is necessary to limit the maximum power dissipation as
follows.
STILL AIR
200LFM
500LFM
1.0
MAXIMUM POWER DISSIPATION (W)
3.0
50 55 60 65 70 75 80 85 90 10095
75 80 85 90 95 100 105 110 115 125120
AMBIENT TEMPERATURE (°C)
THERMAL
SWITCH
DISABLED
ENABLED
05653-002
2.5
2.0
1.5
QUIESCENT
Figure 3. Maximum Power Dissipation vs. Temperature,
AD8387 on a 4-Layer JEDEC PCB with Thermally Optimized Landing
Pattern as Described in the
Applications Section
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on
the human body and test equipment and can discharge without detection. Although this product features
proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy
electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance
degradation or loss of functionality.
