CAV24C64
www.onsemi.com
7
READ OPERATIONS
Immediate Read
To read data from memory, the Master creates a START
condition on the bus and then broadcasts a Slave address
with the R/W
bit set to ‘1’. The Slave responds with ACK
and starts shifting out data residing at the current address.
After receiving the data, the Master responds with NoACK
and terminates the session by creating a STOP condition on
the bus (Figure 10). The Slave then returns to Standby mode.
Selective Read
To read data residing at a specic address, the selected
address must rst be loaded into the internal address register.
This is done by starting a Byte Write sequence, whereby the
Master creates a START condition, then broadcasts a Slave
address with the R/W
bit set to ‘0’ and then sends two
address bytes to the Slave. Rather than completing the Byte
Write sequence by sending data, the Master then creates a
START condition and broadcasts a Slave address with the
R/W
bit set to ‘1’. The Slave responds with ACK after every
byte sent by the Master and then sends out data residing at
the selected address. After receiving the data, the Master
responds with NoACK and then terminates the session by
creating a STOP condition on the bus (Figure 11).
Sequential Read
If, after receiving data sent by the Slave, the Master
responds with ACK, then the Slave will continue
transmitting until the Master responds with NoACK
followed by STOP (Figure 12). During Sequential Read the
internal byte address is automatically incremented up to the
end of memory, where it then wraps around to the beginning
of memory.
Figure 10. Immediate Read Sequence and Timing
SCL
SDA 8th Bit
STOP
NO ACKDATA OUT
89
SLAVE
ADDRESS
S
A
C
K
DATA
BYTE
N
O
A
C
K
S
T
O
P
P
S
T
A
R
T
BUS ACTIVITY:
MASTER
SLAVE
Figure 11. Selective Read Sequence
SLAVE
ADDRESS
S
A
C
K
A
C
K
A
C
K
S
T
A
R
T
SLAVE
S
A
C
K
S
T
A
R
T
P
S
T
O
P
ADDRESS
BYTE
ADDRESS
BYTE ADDRESS
N
O
A
C
K
DATA
BYTE
BUS ACTIVITY:
MASTER
SLAVE
Figure 12. Sequential Read Sequence
S
T
O
P
P
SLAVE
ADDRESS
A
C
K
A
C
K
A
C
K
N
O
A
C
K
A
C
K
DATA
BYTE
n
DATA
BYTE
n+1
DATA
BYTE
n+2
DATA
BYTE
n+x
BUS ACTIVITY:
MASTER
SLAVE
CAV24C64
www.onsemi.com
8
ORDERING INFORMATION
Device Order Number
Specific
Device Marking
Package Type Lead Finish Shipping
CAV24C64YEGT3 C64F TSSOP8 NiPdAu Tape & Reel,
3,000 Units / Reel
CAV24C64YEG (Note 9) C64F TSSOP8 NiPdAu Tube, 100 Units / Tube
CAV24C64WEGT3 24C64F SOIC8, JEDEC NiPdAu Tape & Reel,
3,000 Units / Reel
CAV24C64C4CTR (Note 9) A WLCSP4 SnAgCu Tape & Reel,
5,000 Units / Reel
CAV24C64XET2 (Note 9) TBD SOIC8, EIAJ MatteTin Tape & Reel,
2,000 Units / Reel
For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
9. Please contact your nearest ON Semiconductor Sales office for availability.
ON Semiconductor is licensed by the Philips Corporation to carry the I
2
C bus protocol.
WLCSP4, 0.77x0.77
CASE 567JY
ISSUE C
DATE 07 MAR 2017
SEATING
PLANE
E
D
A
B
PIN A1
REFERENCE
e
A0.05 BC
0.03 C
0.05 C
4X
b
12
B
A
0.05 C
A
A1
A2
C
SCALE 4:1
TOP VIEW
SIDE VIEW
BOTTOM VIEW
NOTE 4
e
PITCH
0.16
4X
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.40
0.40
RECOMMENDED
1
PACKAGE
OUTLINE
PITCH
DETAIL A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE
SPHERICAL CROWNS OF THE SOLDER BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS OF
THE SOLDER BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
6. BACKSIDE COATING IS OPTIONAL.
DIM
A
MIN NOM
−−−
MILLIMETERS
A1
D
E
b 0.15 0.155
e 0.40 BSC
−−−
0.04 0.06
A2 0.23 REF
A3 0.025 REF
0.75 0.77
0.75 0.77
MAX
0.16
0.35
0.08
0.79
0.79
A2
DETAIL A
NOTE 6
DIE COAT
(OPTIONAL)
A3
X = Specific Device Code
Y = Year
W = Work Week
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
GENERIC
MARKING DIAGRAM*
X
YW
NOTE 5
NOTE 3
A
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0
Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98AON85186F
ON SEMICONDUCTOR STANDARD
WLCSP4, 0.77X0.77
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 2

CAV24C64WE-GT3

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Manufacturer:
ON Semiconductor
Description:
EEPROM 64KB I2C SER EEPROM
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