NCP718
www.onsemi.com
9
PACKAGE DIMENSIONS
WDFN6 2x2, 0.65P
CASE 511BR
ISSUE B
MOUNTING FOOTPRINT*
RECOMMENDED
DIMENSIONS: MILLIMETERS
6X
0.45
2.30
1.12
1.72
0.65
PITCH
6X
0.40
1
PACKAGE
OUTLINE
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED TERMINAL AND
IS MEASURED BETWEEN 0.15 AND 0.25 mm FROM
THE TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED PAD AS
WELL AS THE TERMINALS.
5. FOR DEVICES CONTAINING WETTABLE FLANK
OPTION, DETAIL A ALTERNATE CONSTRUCTION
A-2 AND DETAIL B ALTERNATE CONSTRUCTION
B-2 ARE NOT APPLICABLE.
SEATING
PLANE
D
E
0.10 C
A3
A
A1
0.10 C
DIM
A
MIN MAX
MILLIMETERS
0.70 0.80
A1 0.00 0.05
A3 0.20 REF
b 0.25 0.35
D 2.00 BSC
D2 1.50 1.70
0.90 1.10
E
2.00 BSC
E2
e
0.65 BSC
0.20
0.40
L
PIN ONE
REFERENCE
0.05 C
0.05 C
NOTE 4
A0.10 C
NOTE 3
L
e
D2
E2
b
B
3
6
6X
1
4
0.05 C
BOTTOM VIEW
L1
DETAIL A
L
ALTERNATE
CONSTRUCTIONS
L
DETAIL A
DETAIL B
A
B
TOP VIEW
C
SIDE VIEW
--- 0.15
L1
6X
M
M
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTIONS
A1
A3
ALTERNATE B−2ALTERNATE B−1
ALTERNATE A−2ALTERNATE A−1
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