Characteristics BAS70
4/14 Doc ID 12563 Rev 2
Figure 7. Forward voltage drop versus
forward current (typical values)
Figure 8. Differential forward resistance
versus forward current
(typical values)
1.E-01
1.E+00
1.E+01
1.E+02
0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
I
FM
(mA)
Tj=125 °C
Tj=25 °C
V
FM
(V)
10
100
1000
0.1 1.0 10.0
F=100 MHz
Tj=25 °C
R()
F
Ω
I
F
(mA)
Figure 9. Relative variation of thermal
impedance junction to ambient
versus pulse duration
Figure 10. Relative variation of thermal
impedance junction to ambient
versus pulse duration
10
100
1000
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Z
th(j-a)
(°C/W)
Single pulse
SOT-323-6L
t
P
(s)
printed circuit board, epoxy FR4 e = 35 µm SOT-323-6L
CU
0.01
0.10
1.00
1.E-02 1.E-01 1.E+00 1.E+01 1.E+0
Z
th(j-a)
/R
th(j-a)
Single pulse
SOT-23
Aluminesubstrate
10 x 8 x 0.5 mm
t
P
(s)
alluminium oxide substrate 10 x 8 x 0.5 mm SOT-23
Figure 11. Relative variation of thermal
impedance junction to ambient
versus pulse duration
Figure 12. Relative variation of thermal
impedance junction to ambient
versus pulse duration
0.01
0.10
1.00
1.E-02 1.E-01 1.E+00 1.E+01 1.E+02
Z
th(j-a)
/R
th(j-a)
Single pulse
SOD-323
EpoxyFR4
S
CU
=2.25 mm²
e
CU
=35 µm
t
P
(s)
printed circuit board, epoxy FR4 e = 35 µm SOD-323
CU
0.01
0.10
1.00
1.E-03 1.E-02 1.E-01 1.E+00 1.E+01
Z
th(j-a)
/R
th(j-a)
Single pulse
SOT-666
Epoxy FR4
e
CU
=35 µm
t
P
(s)
printed circuit board, epoxy FR4 e = 35 µm SOT-666
CU
