WeEn Semiconductors
BYV29X-600
Ultrafast power diode
BYV29X-600
Product
data
sheet
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WeEn
Semiconductors
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2017.
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7
November
2017 5 / 11
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol Parameter Conditions Min Typ Max Unit
R
th(j-h)
thermal resistance
from junction to
heatsink
with heatsink compound; Fig. 5 - - 5.5 K/W
without heatsink compound - - 5.9 K/W
R
th(j-a)
thermal resistance
from junction to
ambient free air
in free air - 55 - K/W
10
-6
10
-5
10
-4
10
-3
10
-2
10
-1
10
-3
10
-2
10
-1
1
10
t
(s)
th(j-h)
(K/W)
P
t
t
p
T
t
p
δ =
T
δ = 0.5
δ = 0.3
δ = 0.1
δ = 0.05
single pulse
δ = 0.02
δ = 0.01
Fig. 5. Transient thermal impedance from junction to heatsink as a function of pulse duration
10. Isolation characteristics
Table 6. Isolation characteristics
Symbol Parameter Conditions Min Typ Max Unit
V
isol(RMS)
RMS isolation voltage 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %; from all
pins to external heatsink; sinusoidal
waveform; clean and dust free
- - 2500 V
C
isol
isolation capacitance from cathode to external heatsink - 10 - PF