PEMD30_PUMD30_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 31 March 2006 6 of 11
Philips Semiconductors
PEMD30; PUMD30
NPN/PNP double resistor-equipped transistors; R1 = 2.2 k, R2 = open
8. Package outline
9. Packing information
[1] For further information and the availability of packing methods, see Section 13.
[2] T1: normal taping
[3] T2: reverse taping
Fig 5. Package outline SOT363 (SC-88) Fig 6. Package outline SOT666
04-11-08Dimensions in mm
0.25
0.10
0.3
0.2
pin 1
index
1.3
0.65
2.2
2.0
1.35
1.15
2.2
1.8
1.1
0.8
0.45
0.15
132
465
Dimensions in mm
04-11-08
1.7
1.5
1.7
1.5
1.3
1.1
1
0.18
0.08
0.27
0.17
0.5
pin 1 index
123
456
0.6
0.5
0.3
0.1
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.
[1]
Type number Package Description Packing quantity
3000 4000 8000 10000
PEMD30 SOT666 2 mm pitch, 8 mm tape and reel - - -315 -
4 mm pitch, 8 mm tape and reel - -115 - -
PUMD30 SOT363 4 mm pitch, 8 mm tape and reel; T1
[2]
-115 - - -135
4 mm pitch, 8 mm tape and reel; T2
[3]
-125 - - -165
PEMD30_PUMD30_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 31 March 2006 7 of 11
Philips Semiconductors
PEMD30; PUMD30
NPN/PNP double resistor-equipped transistors; R1 = 2.2 k, R2 = open
10. Soldering
Dimensions in mm
Fig 7. Reflow soldering footprint SOT363 (SC-88)
Fig 8. Wave soldering footprint SOT363 (SC-88)
MSA432
solder lands
solder resist
occupied area
solder paste
1.20
2.40
0.50
(4×)
0.40
(2×)
0.90 2.10
0.50
(4×)
0.60
(2×)
2.35
2.65
solder lands
solder resist
occupied area
1.15
3.75
transport direction during soldering
1.000.30 4.00
4.50
5.25
sot363
Dimensions in mm
PEMD30_PUMD30_1 © Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet Rev. 01 — 31 March 2006 8 of 11
Philips Semiconductors
PEMD30; PUMD30
NPN/PNP double resistor-equipped transistors; R1 = 2.2 k, R2 = open
Reflow soldering is the only recommended soldering method.
Fig 9. Reflow soldering footprint SOT666
solder lands
solder resist
placement area
occupied area
0.075
Dimensions in mm
2.75
2.45
2.10
1.60
1.20
2.20
2.50
2.00 1.70 1.00
0.30 (2×)
0.15
(4
×)
0.375
(4
×)
0.40
(6
×)
0.55
(2
×)

PEMD30,315

Mfr. #:
Manufacturer:
Nexperia
Description:
Bipolar Transistors - Pre-Biased TransDigital BJT NPN PNP 50V 100mA 6-Pin
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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