Ceramic transient voltage suppressors B72500E2170S170
SMD multilayer varistor, E series CT0603S17ALCG2
PPD ML PD 2013-04-10
Please read Cautions and warnings and Page 6 of 13
Important notes at the end of this document.
Recommended soldering profiles
Reflow soldering
Recommended temperature characteristic for reflow soldering following JEDEC J-STD-020D
Profile feature Sn-Pb eutectic assembly Pb-free assembly
Preheat and soak
- Temperature min
- Temperature max
- Time
T
smin
T
smax
t
smin
to t
smax
100 °C
150 °C
60 … 120 s
150 °C
200 °C
60 … 180 s
Average ramp-up rate T
smax
to T
p
3 °C/s max. 3 °C/s max.
Liquidous temperature
Time at liquidous
T
L
t
L
183 °C
60 … 150 s
217 °C
60 … 150 s
Peak package body temperature T
p
1)
220 °C … 235 °C
2)
245 °C … 260 °C
2)
Time (t
p
)
3)
within 5 °C of specified
classification temperature (T
c
)
20 s
3)
30 s
3)
Average ramp-down rate T
p
to T
smax
6 °C/s max. 6 °C/s max.
Time 25 °C to peak temperature maximum 6 min maximum 8 min
1) Tolerance for peak profile temperature (T
p
) is defined as a supplier minimum and a user maximum.
2) Depending on package thickness. For details please refer to JEDEC J-STD-020D.
3) Tolerance for time at peak profile temperature (t
p
) is defined as a supplier minimum and a user maximum.
Note: All temperatures refer to topside of the package, measured on the package body surface.
Number of reflow cycles: 3
