2. Design Considerations
2.1 Typical Application Schematic
2.2 Comments and Recommendations
Decoupling Capacitor: A decoupling capacitor of 0.1 μF must be used between VDD and VSS on pin 1. Place the capacitor on the
component side of the PCB as close to the VDD pin as possible. The PCB trace to the VDD pin and to the GND via should be kept as
short as possible. Do not use vias between the decoupling capacitor and the VDD pin. In addition, a 10 µF capacitor should be placed
between VDD and VSS.
Series Termination Resistor: A series termination resistor is recommended if the distance between the outputs (SSCLK or REFCLK
pins) and the load is over 1 ½ inches. The nominal impedance of the SSCLK output is about 30 Ω. Use a 20 Ω resistor in series with the
output to terminate a 50 Ω trace impedance and place a 20 Ω resistor as close to the SSCLK output as possible.
Crystal and Crystal Load: Only use a parallel resonant fundamental AT cut crystal. Do not use higher overtone crystals. To meet the
crystal initial accuracy specification (in ppm) make sure that the external crystal load capacitor is matched to the crystal load specifica-
tion. To determine the value of CL1 and CL2, use the following formula:
CL1 = CL2 = 2CL − (Cpin + Cp);
where CL is the load capacitance stated by the crystal manufacturer,
Cpin is the Si51214 pin capacitance (3 pF), and
Cp is the parasitic capacitance of the PCB traces.
Example: If a crystal with CL = 12 pF specification is used and Cp = 1 pF (parasitic PCB capacitance on PCB), 19 or 20 pF external
capacitors from pins XIN (pin 2) and XOUT (Pin 3) to VSS are required. Users must verify Cp value.
Table 2.1. Crystal Specifications
Equivalent Series Resistance (ESR) Crystal Output Capacitance (CO) Load Capacitance (CL)
< 50 Ω < 3 pF < 13 pF
Si51214 Data Sheet
Design Considerations
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