SUD35N10-26P-GE3

SUD35N10-26P
www.vishay.com
Vishay Siliconix
S15-1599-Rev. B, 06-Jul-15
1
Document Number: 69796
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
N-Channel 100 V (D-S) MOSFET
Ordering Information:
SUD35N10-26P-E3 (lead (Pb)-free)
FEATURES
TrenchFET
®
power MOSFET
100 % UIS tested
Material categorization:
for definitions of compliance please see
www.vishay.com/doc?99912
APPLICATIONS
Primary side switch
Notes
a. Based on T
C
= 25 °C.
b. Surface mounted on 1" x 1" FR4 board.
c. t = 10 s.
d. Maximum under steady state conditions is 50 °C/W.
e. Calculated based on maximum junction temperature. Package limitation current is 50 A.
PRODUCT SUMMARY
V
DS
(V) R
DS(on)
(Ω)I
D
(A)
a
Q
g
(TYP.)
100
0.0260 at V
GS
= 10 V 35
31 nC
0.0375 at V
GS
= 7 V 31
TO-252
Top View
TO
G
D
S
Drain connected to tab
N-Channel MOSFET
G
D
S
ABSOLUTE MAXIMUM RATINGS (T
A
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL LIMIT UNIT
Drain-Source Voltage V
DS
100
V
Gate-Source Voltage V
GS
± 20
Continuous Drain Current (T
J
= 175 °C)
T
C
= 25 °C
I
D
35
A
T
C
= 70 °C 32
T
A
= 25 °C 12
b, c
T
A
= 70 °C 10
b, c
Pulsed Drain Current I
DM
40
Continuous Source-Drain Diode Current
T
C
= 25 °C
I
S
50
e
T
A
= 25 °C 6.9
b, c
Avalanche Current Pulse
L = 0.1 mH
I
AS
33
Single Pulse Avalanche Energy E
AS
55 mJ
Maximum Power Dissipation
T
C
= 25 °C
P
D
83
W
T
C
= 70 °C 58
T
A
= 25 °C 8.3
b, c
T
A
= 70 °C 5.8
b, c
Operating Junction and Storage Temperature Range T
J
, T
stg
-55 to +175 °C
THERMAL RESISTANCE RATINGS
PARAMETER SYMBOL TYPICAL MAXIMUM UNIT
Maximum Junction-to-Ambient
b, d
t 10 s R
thJA
15 18
°C/W
Maximum Junction-to-Case Steady State R
thJC
1.5 1.8
SUD35N10-26P
www.vishay.com
Vishay Siliconix
S15-1599-Rev. B, 06-Jul-15
2
Document Number: 69796
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Note
a. Pulse test; pulse width 300 μs, duty cycle 2 %.
b. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
SPECIFICATIONS (T
J
= 25 °C, unless otherwise noted)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNIT
Static
Drain-Source Breakdown Voltage V
DS
V
GS
= 0 V, I
D
= 250 μA 100 - - V
V
DS
Temperature Coefficient ΔV
DS
/T
J
I
D
= 250 μA
- 165 -
mV/°C
V
GS(th)
Temperature Coefficient ΔV
GS(th)
/T
J
--11-
Gate-Source Threshold Voltage V
GS(th)
V
DS
= V
GS
, I
D
= 250 μA 2.5 - 4.4 V
Gate-Source Leakage I
GSS
V
DS
= 0 V, V
GS
= ± 20 V - - ± 100 nA
Zero Gate Voltage Drain Current I
DSS
V
DS
= 100 V, V
GS
= 0 V - - 1
μA
V
DS
= 100 V, V
GS
= 0 V, T
J
= 55 °C - - 10
On-State Drain Current
a
I
D(on)
V
DS
5 V, V
GS
= 10 V 40 - - A
Drain-Source On-State Resistance
a
R
DS(on)
V
GS
= 10 V, I
D
= 12 A - 0.0210 0.0260
Ω
V
GS
= 7 V, I
D
= 8 A - 0.0285 0.0375
Forward Transconductance
a
g
fs
V
DS
= 15 V, I
D
= 12 A - 25 - S
Dynamic
b
Input Capacitance C
iss
V
DS
= 12 V, V
GS
= 0 V, f = 1 MHz
- 2000 -
pFOutput Capacitance C
oss
- 180 -
Reverse Transfer Capacitance C
rss
-60-
Total Gate Charge Q
g
V
DS
= 50 V, V
GS
= 10 V, I
D
= 12 A
-3147
nCGate-Source Charge Q
gs
-10-
Gate-Drain Charge Q
gd
-9-
Gate Resistance R
g
f = 1 MHz - 1.5 - Ω
Turn-On Delay Time t
d(on)
V
DD
= 50 V, R
L
= 5 Ω
I
D
10 A, V
GEN
= 10 V, R
g
= 1 Ω
-1015
ns
Rise Time t
r
-1015
Turn-Off Delay Time t
d(off)
-1525
Fall Time t
f
-1015
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current I
S
T
C
= 25 °C - - 50
A
Pulse Diode Forward Current
a
I
SM
--40
Body Diode Voltage V
SD
I
S
= 10 A - 0.8 1.2 V
Body Diode Reverse Recovery Time t
rr
I
F
= 10 A, di/dt = 100 A/μs, T
J
= 25 °C
-5075ns
Body Diode Reverse Recovery Charge Q
rr
- 100 150 nC
Reverse Recovery Fall Time t
a
-38-
ns
Reverse Recovery Rise Time t
b
-12-
SUD35N10-26P
www.vishay.com
Vishay Siliconix
S15-1599-Rev. B, 06-Jul-15
3
Document Number: 69796
For technical questions, contact: pmostechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
TYPICAL CHARACTERISTICS (25 °C, unless otherwise noted)
Output Characteristics
On-Resistance vs. Drain Current
Gate Charge
Transfer Characteristics
Capacitance
On-Resistance vs. Junction Temperature
0
10
20
30
40
0.0 0.5 1.0 1.5 2.0 2.5 3.0
V
DS
- Drain-to-Source Voltage (V)
- Drain Current (A)
I
D
V
GS
=10Vthru7V
V
GS
=5V
V
GS
=6V
V
GS
=4V
0.020
0.021
0.022
0.023
0 10203040
- On-Resistance (Ω)R
DS(on)
I
D
- Drain Current (A)
V
GS
=10V
0
2
4
6
8
10
0 5 10 15 20 25 30 35
I
D
=12A
- Gate-to-Source Voltage (V)
Q
g
- Total Gate Charge (nC)
V
GS
V
DS
=80V
V
DS
=50V
0
2
4
6
8
10
0123456
V
GS
- Gate-to-Source Voltage (V)
- Drain Current (A)I
D
T
C
=25 °C
T
C
= - 55 °C
T
C
= 125 °C
C
rss
0
500
1000
1500
2000
2500
0 20406080100
C
oss
C
iss
V
DS
- Drain-to-Source Voltage (V)
C - Capacitance (pF)
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
2.0
2.2
- 50 - 25 0 25 50 75 100 125 150 175
T
J
- Junction Temperature (°C)
(Normalized)- On-Resistance
R
DS(on)
I
D
=12A
V
GS
=10V

SUD35N10-26P-GE3

Mfr. #:
Manufacturer:
Vishay / Siliconix
Description:
MOSFET 100V 35A 83W 26mohm @ 10V
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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