LT4254
13
4254fb
LT4254 stays in current limit long enough for the TIMER
pin to fully charge up to its threshold, the LT4254 will
either latch off (RETRY = 0) or go into the current limit
hiccup mode (RETRY = floating). In either case, an open
FET condition will be falsely signalled. If the LT4254 does
go into current limit during start-up, C1 can be increased
(see Power-Up Sequence).
Supply Transient Protection
The LT4254 is 100% tested and guaranteed to be safe
from damage with supply voltages up to 44V. However,
voltage transients above 44V may damage the part.
During a short-circuit condition, the large change in
currents flowing through the power supply traces can
cause inductive voltage transients which could exceed
44V. To minimize the voltage transients, the power trace
parasitic inductance should be minimized by using wider
traces or heavier trace plating and a 0.1µF bypass capaci-
tor should be placed between V
CC
and GND. A surge
APPLICATIO S I FOR ATIO
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suppressor (Transorb) at the input can also prevent
damage from voltage transients.
GATE Pin
A curve of gate drive vs V
CC
is shown in Figure 13. The
GATE pin is clamped to a maximum voltage of 12V above
the V
CC
voltage. This clamp is designed to withstand the
internal charge pump current. An external zener diode
should be used if the possibility exists for an instanta-
neous low resistance short on V
OUT
to occur. At a mini-
mum input supply voltage of 12V, the minimum gate drive
voltage is 4.5V. When the input supply voltage is higher
than 20V, the gate drive voltage is at least 10V and a
Figure 11. Active Low Enable PWRGD Application
4254 F11
R5
100m
LT4254
SENSE
13
10
5
7
8
16 15
1
2
4
9
V
CC
GATE
FB
PWRGD
RETRY
UV
OV
TIMER
GND
V
CC
(SHORT PIN)
Q1
IRF530
D1
CMPZ5241B
11V
R3
40.2k
R2
40.2k
R1
324k
R7
100
R6
10
V
OUT
V
LOGIC
R4
27k
R8
140k
C
L
R10
27k
C2
33nF
C3
0.1µF
C1
10nF
OPEN
UV = 20V
OV = 40V
PWRGD = 18V
R9
40.2k
Q2
PWRGD
GND
Figure 12. Delay Circuit for OPEN FET Detection
4
R
C
4254 F12
OPEN
LT4254
TO
MONITORING
LOGIC
V
LOGIC
INTERNAL
OPEN COLLECTOR
PULL-DOWN
Figure 13. V
GATE
vs V
CC
V
CC
(V)
10
V
GATE
(V)
8
9
10
4254 F13
7
6
4
20
30
40
5
12
11
V
GATE
= V
GATE
– V
CC
LT4254
14
4254fb
APPLICATIO S I FOR ATIO
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standard threshold MOSFET can be used. In applications
from 12V to 15V range, a logic level MOSFET must be
used.
In some applications it may be possible for the V
OUT
pin to
ring below ground (due to the parasitic trace inductance).
Higher current applications, especially where the output
load is physically far away from the LT4254 will be more
susceptible to these transients. This is normal and the
LT4254 has been designed to allow for some ringing
below ground. However, if the application is such that
V
OUT
can ring more than 1V below ground, damage may
occur to the LT4254 and an external diode from ground
(anode) to V
OUT
(cathode) will have to be added to the
circuit as shown in Figure 14 (it is critical that the reverse
breakdown voltage of the diode be higher than the highest
expected V
CC
voltage). A capacitor placed from ground to
V
OUT
directly at the LT4254 pins can help reduce the
amount of ringing on V
OUT
but it may not be enough for
some applications.
During a fault condition, the LT4254 pulls down on the
GATE pin with a switch capable of sinking about 55mA.
Once the GATE voltage drops below the output voltage by
a diode forward voltage, the external zener will forward
bias and the output will also be discharged to GND. In
addition to the GATE capacitance, the output capacitance
will be discharged through the LT4254. In applications
that have very large output capacitors, this could cause
damage to the LT4254. Therefore, the maximum output
capacitance that can be used with the LT4254 is 1000µF.
In applications utilizing very large external N-channel
MOSFETs, the possibility exists for the MOSFET to turn on
when initially inserted into a live backplane (before the
LT4254 becomes active and pulls down on GATE). This is
due to the drain to gate capacitance forcing current into R7
and C1 when the drain voltage steps up from ground to V
CC
with an extremely fast rise time. To alleviate this situation,
a Schottky diode should be put across R7 with the cathode
connected to C1 as shown in Figure 16.
Layout Considerations
To achieve accurate current sensing, a Kelvin connection
to the current sense resistor (R5 in typical application
circuit) is recommended. The minimum trace width for
1oz copper foil is 0.02" per amp to make sure the trace
stays at a reasonable temperature. 0.03" per amp or wider
is recommended. Note that 1oz copper exhibits a sheet
resistance of about 530µ/
. Small resistances can cause
large errors in high current applications. Noise immunity
will be improved significantly by locating resistor dividers
close to the pins with short V
CC
and GND traces. A 0.1µF
decoupling capacitor from UV to GND is also required.
Figure 15 shows a layout that meets these requirements.
Figure 14. Negative Output Voltage Protection Diode Application
4254 F14
R5
0.033
LT4254
SENSE
13
10
5
7
8
16 15
1
2
4
9
V
CC
GATE
FB
PWRGD
RETRY
UV
OV
TIMER
GND
V
CC
(SHORT PIN)
Q1
IRF530
D1
CMPZ5241B
11V
MRA4003T3
R3
40.2k
R2
40.2k
R1
324k
R7
100
R9
40.2k
R6
10
R8
140k
V
OUT
R4
27k
C
L
100µF
C2
33nF
C3
0.1µF
C1
10nF
OPEN
UV = 20V
OV = 40V
PWRGD = 18V
GND
LT4254
15
4254fb
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Figure 15. Recommended Component Placement
U
PACKAGE DESCRIPTIO
GN Package
16-Lead Plastic SSOP (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1641)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
UV
OV
NC
OPEN
PWRGD
NC
RETRY
GND
V
CC
SENSE
NC
GATE
NC
NC
FB
TIMER
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
R6
Q1
V
OUT
R7
R5
R
SENSE
R4
PWRGD
OPEN
GND
4254 F15
GND
R8
D1
R3
LT4254
R2
R1
V
CC
C2
C1
R9
V
CC
SHORT
PIN
VIA
2ND LAYER METAL
GN16 (SSOP) 0204
12
3
4
5
6
7
8
.229 – .244
(5.817 – 6.198)
.150 – .157**
(3.810 – 3.988)
16
15
14
13
.189 – .196*
(4.801 – 4.978)
12 11 10
9
.016 – .050
(0.406 – 1.270)
.015
± .004
(0.38 ± 0.10)
× 45°
0° – 8° TYP
.007 – .0098
(0.178 – 0.249)
.0532 – .0688
(1.35 – 1.75)
.008 – .012
(0.203 – 0.305)
TYP
.004 – .0098
(0.102 – 0.249)
.0250
(0.635)
BSC
.009
(0.229)
REF
.254 MIN
RECOMMENDED SOLDER PAD LAYOUT
.150 – .165
.0250 BSC.0165 ± .0015
.045 ±.005
*DIMENSION DOES NOT INCLUDE MOLD FLASH. MOLD FLASH
SHALL NOT EXCEED 0.006" (0.152mm) PER SIDE
**DIMENSION DOES NOT INCLUDE INTERLEAD FLASH. INTERLEAD
FLASH SHALL NOT EXCEED 0.010" (0.254mm) PER SIDE
INCHES
(MILLIMETERS)
NOTE:
1. CONTROLLING DIMENSION: INCHES
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE

LT4254CGN#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
Hot Swap Voltage Controllers Hot Swap Controller with Open Circuit Detect
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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