MJH11017, MJH11019, MJH11021 (PNP) MJH11018, MJH11020, MJH11022 (NPN)
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4
Figure 2. Switching Times Test Circuit
R
B
& R
C
varied to obtain desired current levels
D
1
, must be fast recovery types, e.g.:
1N5825 used above I
B
≈ 100 mA
MSD6100 used below I
B
≈ 100 mA
t
r
, t
f
≤ 10 ns
Duty Cycle = 1.0%
For t
d
and t
r
, D
1
is disconnected
and V2 = 0
For NPN test circuit, reverse diode and voltage polarities.
V2
APPROX
+12 V
0
V1
APPROX
-8.0 V
V
CC
-100 V
TUT
SCOPE
R
B
+4.0 V
D
1
51
R
C
25 ms
Figure 3. Thermal Response
t, TIME (ms)
1.0
0.01
0.02
0.7
0.2
0.1
0.05
0.02
r(t), EFFECTIVE TRANSIENT THERMAL
0.05 1.0 2.0 5.0 10 20 50 100 200 500
R
q
JC
(t) = r(t) R
q
JC
R
q
JC
= 0.83°C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t
1
T
J(pk)
- T
C
= P
(pk)
R
q
JC
(t)
P
(pk)
t
1
t
2
DUTY CYCLE, D = t
1
/t
2
D = 0.5
SINGLE PULSE
0.1 0.50.2
RESISTANCE (NORMALIZED)
100
0.5
0.3
0.07
0.03
0.01 0.03 3.0 30 3000.3
0.2
0.1
0.05
0.02
0.01
WIRE BOND LIMIT
THERMAL LIMIT
SECOND BREAKDOWN LIMIT
0.5 ms
Figure 4. Maximum Rated Forward Bias
Safe Operating Area (FBSOA)
1.0 ms
5.0 ms
0.1 ms
dc
V
CE
, COLLECTOR-EMITTER VOLTAGE (VOLTS)
2.0
30
2.0
I
C
, COLLECTOR CURRENT (AMPS)
3.0 10
10
0.5
0.2
5.0
20
1.0
20 100
0
T
C
= 25°C SINGLE PULSE
5.0 50 25015030
MJH11017, MJH11018
MJH11019, MJH11020
MJH11021, MJH11022
FORWARD BIAS
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate I
C
− V
CE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 4 is based on T
J(pk)
= 150_C; T
C
is
variable depending on conditions. Second breakdown pulse
limits are valid for duty cycles to 10% provided T
J(pk)
v 150_C. T
J(pk)
may be calculated from the data in
Figure 3. At high case temperatures, thermal limitations will
reduce the power that can be handled to values less than the
limitations imposed by second breakdown.
