Lineage Power 13
Data Sheet
March 28, 2008
3.0 Vdc - 5.5 Vdc Input, 0.9 Vdc - 3.3 Vdc Output, 10 A
Austin Lynx
TM
SMT Non-Isolated dc-dc Power Modules:
Layout Considerations
Copper paths must not be routed beneath the power module.
Surface Mount Information
Pick and Place Area
Although the module weight is minimized by using open-
frame construction, the modules have a relatively large mass
compared to conventional surface-mount components. To
optimize the pick-and-place process, automated vacuum
equipment variables such as nozzle size, tip style, vacuum
pressure, and placement speed should be considered. Austin
Lynx™ SMT modules have a flat surface which serves as a
pick-and-place location for automated vacuum equipment.
The module’s pick-and-place location is identified by the tar-
get symbol on the top label as shown in Figure 28.
Figure 28. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by using
open frame construction. Even so, these modules have a rel-
atively large mass when compared to conventional SMT
components. Variables such as nozzle size, tip style, vac-
uum pressure and pick & placement speed should be consid-
ered to optimize this process. The minimum recommended
nozzle diameter for reliable operation is 3mm. The maximum
nozzle outer diameter, which will safely fit within the allowable
component spacing, is 12 mm max.
Tin Lead Soldering
The Austin Lynx
TM
SMT power modules are lead free mod-
ules and can be soldered either in a lead-free solder process
or in a conventional Tin/Lead (Sn/Pb) process. It is recom-
mended that the customer review data sheets in order to cus-
tomize the solder reflow profile for each application board
assembly. The following instructions must be observed when
soldering these units. Failure to observe these instructions
may result in the failure of or cause damage to the modules,
and can adversely affect long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process peak
reflow temperatures are limited to less than 235
o
C. Typically,
the eutectic solder melts at 183
o
C, wets the land, and subse-
quently wicks the device connection. Sufficient time must be
allowed to fuse the plating on the connection to ensure a reli-
able solder joint. There are several types of SMT reflow
technologies currently used in the industry. These surface
mount power modules can be reliably soldered using natural
forced convection, IR (radiant infrared), or a combination of
convection/IR. For reliable soldering the solder reflow profile
should be established by accurately measuring the modules
CP connector temperatures.
Figure 29. Reflow Profile.
Figure 30. Time Limit curve above 205
0
C.
Lead Free Soldering
The –Z version Austin Lynx SMT modules are lead-free (Pb-
free) and RoHS compliant and are both forward and back-
ward compatible in a Pb-free and a SnPb soldering process.
Failure to observe the instructions below may result in the
failure of or cause damage to the modules and can adversely
affect long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C (Mois-
ture/Reflow Sensitivity Classification for Nonhermetic Solid
State Surface Mount Devices) for both Pb-free solder profiles
and MSL classification procedures. This standard provides a
recommended forced-air-convection reflow profile based on
the volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC). The rec-
ommended linear reflow profile using Sn/Ag/Cu solder is
shown in Figure. 31.
0
50
100
150
200
250
300
REFLOW TIME (S)
Preheat zone
max 4
o
Cs
-1
Soak zone
30-240s
Heat zone
max 4
o
Cs
-1
Peak Temp 235
o
C
Cooling
zone
1-4
o
Cs
-1
T
lim
above
205
o
C
200
205
210
215
220
225
230
235
240
0 10 20
30
40
50 60
TIME (S)
