DMP6110SVT
Document number: DS37594 Rev. 2 - 2
April 2015
© Diodes Incorporated
Maximum Ratings (@T
A
= +25°C, unless otherwise specified.)
Continuous Drain Current (Note 6) V
GS
= -10V
Maximum Body Diode Forward Current (Note 6)
Pulsed Drain Current (380µs Pulse, 1% Duty Cycle)
Avalanche Current (Note 7) L = 0.1mH
Repetitive Avalanche Energy (Note 7) L = 0.1mH
Thermal Characteristics (@T
A
= +25°C, unless otherwise specified.)
Total Power Dissipation (Note 5)
Thermal Resistance, Junction to Ambient (Note 5)
Total Power Dissipation (Note 6)
Thermal Resistance, Junction to Ambient (Note 6)
Thermal Resistance, Junction to Case (Note 6)
Operating and Storage Temperature Range
Electrical Characteristics (@T
A
= +25°C, unless otherwise specified.)
OFF CHARACTERISTICS (Note 8)
Drain-Source Breakdown Voltage
Zero Gate Voltage Drain Current
ON CHARACTERISTICS (Note 8)
V
DS
= V
GS
, I
D
= -250µA
Static Drain-Source On-Resistance
V
GS
= -4.5V, I
D
= -3.5A
DYNAMIC CHARACTERISTICS (Note 9)
V
DS
= -30V, V
GS
= 0V, f = 1.0MHz
Reverse Transfer Capacitance
V
DS
= 0V, V
GS
= 0V, f = 1.0MHz
Total Gate Charge (V
GS
= -4.5V)
Total Gate Charge (V
GS
= -10V)
V
GS
= -10V, V
DS
= -30V, R
GEN
= 3Ω,
I
D
= -12A
Body Diode Reverse Recovery Time
I
S
= -12A, dI/dt = 100A/μs
Body Diode Reverse Recovery Charge
Notes: 5. Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout.
6. Device mounted on FR-4 substrate PC board, 2oz copper, with 1inch square copper plate.
7. I
AS
and E
AS
rating are based on low frequency and duty cycles to keep T
J
= +25°C.
8. Short duration pulse test used to minimize self-heating effect.
9. Guaranteed by design. Not subject to product testing.