SpecNo.JELF243A-9139-01 P.9/11
MURATA MFG.CO.,LTD
Reference Only
9.8 Resin coating
The inductance value may change due to high cure-stress of resin to be used for coating/molding products.
An open circuit issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or
operating condition etc. Some resin contains some impurities or chloride possible to generate chlorine by
hydrolysis under some operating condition may cause corrosion of wire of coil, leading to open circuit.
So, please pay your careful attention when you select resin in case of coating/molding the products
with the resin.
Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products
mounted on your board.
9.9 Caution for use
・Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush , shall not be
touched to the winding portion to prevent the breaking of wire.
・Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.
9.10 Notice of product handling at mounting
In some mounting machines,when picking up components support pin pushes up the components from the
bottom of base tape. In this case, please remove the support pin. The support pin may damage the components
and break wire.
In rare case ,the laser recognition can not recognize this component. Please contact us when you use laser
recognition. (There is no problem with the permeation and reflection type.)
9.11 Handling of a substrate
After mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the
substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw
to the substrate.
Excessive mechanical stress may cause cracking in the product.
Bending Twisting
9.12 Storage and Handing Requirements
(1) Storage period
Use the products within 12 months after delivered.
Solderability should be checked if this period is exceeded.
(2) Storage conditions
・Products should be stored in the warehouse on the following conditions.
Temperature ： -10°C to 40°C
Humidity ： 15% to 85% relative humidity No rapid change on temperature and humidity
・Don't keep products in corrosive gases such as sulfur,chlorine gas or acid, or it may cause
oxidization of electrode, resulting in poor solderability.
・Products should not be stored on bulk packaging condition to prevent the chipping of the
core and the breaking of winding wire caused by the collision between the products.
・Products should be stored on the palette for the prevention of the influence from humidity,
dust and so on.
・Products should be stored in the warehouse without heat shock, vibration, direct sunlight and so on.
(3) Handling Condition
Care should be taken when transporting or handling product to avoid excessive vibration or
mechanical shock.
