NCP1271
http://onsemi.com
21
PACKAGE DIMENSIONS
SOIC−7
D SUFFIX
CASE 751U−01
ISSUE C
SEATING
PLANE
1
4
58
R
J
X 45
_
K
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B ARE DATUMS AND T
IS A DATUM SURFACE.
4. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
5. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
S
D
H
C
DIM
A
MIN MAX MIN MAX
INCHES
4.80 5.00 0.189 0.197
MILLIMETERS
B 3.80 4.00 0.150 0.157
C 1.35 1.75 0.053 0.069
D 0.33 0.51 0.013 0.020
G 1.27 BSC 0.050 BSC
H 0.10 0.25 0.004 0.010
J 0.19 0.25 0.007 0.010
K 0.40 1.27 0.016 0.050
M 0 8 0 8
N 0.25 0.50 0.010 0.020
S 5.80 6.20 0.228 0.244
−A−
−B−
G
M
B
M
0.25 (0.010)
−T−
B
M
0.25 (0.010) T
S
A
S
M
7 PL
____
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NCP1271/D
Soft−Skip is a trademark of Semiconductor Components Industries, LLC (SCILLC).
The product described herein (NCP1271), may be covered by the following U.S. patents: 6,271,735, 6,362,067, 6,385,060, 6,597,221, 6,633,193. There may
be other patents pending.
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