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TEA1751T/1791/DB/9

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P31
TEA1751T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3 — 10 January 2013 25 of 31
NXP Semiconductors
TEA1751T
HV start-up flyback controller with integrated PFC controller
[1] Applies to a typical application with a compensation network on the PFCCOMP pin, like the example in Figure 3.
[2] Minimum required voltage change time for valley recognition on the PFCAUX pin.
[3] Minimum time required between demagnetization detection and V/t = 0 on the PFCAUX pin.
[4] Hysteresis for PFC on/off control.
[5] Guaranteed by design.
I
FBAUX
=360A 0.34 0.38 0.42 V
Driver (FBDRIVER pin)
I
src(FBDRIVER)
source current on the
FBDRIVER pin
V
FBDRIVER
=2V - 0.5 - A
I
sink(FBDRIVER)
sink current on the FBDRIVER
pin
V
FBDRIVER
=2V - 0.7 - A
V
FBDRIVER
=10V -1.2-A
V
O(FBDRIVER)(max)
maximum output voltage on the
FBDRIVER pin
9.5 10.8 12 V
LATCH input (LATCH pin)
V
prot(LATCH)
protection voltage on the
LATCH pin
1.23 1.25 1.27 V
I
O(LATCH)
output current on the LATCH
pin
V
prot(LATCH)
<V
LATCH
<V
oc(LATCH)
85 80 75 A
V
en(LATCH)
enable voltage on the LATCH
pin
at start-up 1.30 1.35 1.40 V
V
hys(LATCH)
hysteresis voltage on the
LATCH pin
V
en(LATCH)
V
prot(LATCH)
80 100 140 mV
V
oc(LATCH)
open-circuit voltage on the
LATCH pin
2.65 2.9 3.15 V
Temperature protection
T
pl(IC)
IC protection level temperature 130 140 150 C
T
pl(IC)hys
hysteresis of IC protection level
temperature
-10-C
Table 5. Characteristics
…continued
T
amb
=25
C; V
CC
= 20 V; all voltages are measured with respect to ground; currents are positive when flowing into the IC;
unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
TEA1751T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3 — 10 January 2013 26 of 31
NXP Semiconductors
TEA1751T
HV start-up flyback controller with integrated PFC controller
11. Application information
A power supply with the TEA1751T consists of a power factor correction circuit and a
flyback converter. See Figure 16
.
Capacitor C
VCC
buffers the IC supply voltage. The IC is powered from the high voltage
rectified mains during start-up and the auxiliary winding of the flyback converter during
operation. Sense resistors R
SENSE1
and R
SENSE2
convert the current through the
MOSFETs S1 and S2 into a voltage at pins PFCSENSE and FBSENSE. The values of
R
SENSE1
and R
SENSE2
define the maximum primary peak current in MOSFETs S1 and S2.
In the example given, the LATCH pin is connected to a Negative Temperature Coefficient
(NTC) resistor. The protection is activated when the resistance drops below a value
calculated as follows:
(8)
A capacitor C
TIMEOUT
is connected to the FBCTRL pin. R
LOOP
is added so that the
time-out capacitor does not interfere with the normal regulation loop.
R
S1
and R
S2
are added to prevent the soft-start capacitors from being charged during
normal operation due to negative voltage spikes across the sense resistors.
Resistor R
AUX1
is added to protect the IC from damage during lightning events.
V
prot LATCH
I
OLATCH
-------------------------------
15.6 k=
Fig 16. Typical application diagram for the TEA1751T
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TEA1751T All information provided in this document is subject to legal disclaimers. © NXP B.V. 2013. All rights reserved.
Product data sheet Rev. 3 — 10 January 2013 27 of 31
NXP Semiconductors
TEA1751T
HV start-up flyback controller with integrated PFC controller
12. Package outline
Fig 17. Package outline SOT109-1 (SO16)
X
w M
θ
A
A
1
A
2
b
p
D
H
E
L
p
Q
detail X
E
Z
e
c
L
v M
A
(A )
3
A
8
9
1
16
y
pin 1 index
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1) (1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
mm
inches
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
1.27
6.2
5.8
0.7
0.6
0.7
0.3
8
0
o
o
0.25 0.1
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
1.0
0.4
SOT109-1
99-12-27
03-02-19
076E07 MS-012
0.069
0.010
0.004
0.057
0.049
0.01
0.019
0.014
0.0100
0.0075
0.39
0.38
0.16
0.15
0.05
1.05
0.041
0.244
0.228
0.028
0.020
0.028
0.012
0.01
0.25
0.01 0.004
0.039
0.016
0 2.5 5 mm
scale
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P18P19-P21P22-P24P25-P27P28-P30P31-P31

TEA1751T/1791/DB/9

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Manufacturer:
NXP Semiconductors
Description:
Power Management IC Development Tools TEA1751 demoboard
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