GP1S396HCP0F
7
Sheet No.: OP13018EN
0.86mm or more
0.86mm or more
Notes
Circuit design
In circuit designing, make allowance for the degradation of the light emitting diode output that results
from long continuous operation. (50% degradation/5 years)
Prevention of detection error
To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the
external light.
Position of opaque board
Opaque board shall be installed at place 0.86mm or more from the top of elements.
(Example)
Soldering
Hand soldering
Please solder to each lead pin at 0.2mm or more from the bottom face of package through the substrate at 300°C
for 3 seconds or less.
Please don't bend lead pins from the root of package when soldering.
And please take care not to apply outer force to both lead pins and the package.
Please don't do soldering with preheating, and please don't do soldering by reflow.
In case of repairing, please make sure GP1S396HCP0F is cooled down, please consider the outer mold resin
is meltdown in case a continuous heat is applied.
Since the tip of the lead has exposed lead frame base material, there is a case not to be soldered.
Cleaning
Cleaning shall be carried out under the below conditions to avoid keeping solvent, solder and flux on the device.
(1) Solvent cleaning : Solvent temperature 45°C or less, Immersion for 3 min. or less
(2) Ultrasonic cleaning : Since the influence to the product may changes by the conditions of the ultrasonic
power, time, the tank size, PCB size, the product installation condition, etc., please evaluate with actual
conditions and confirm before usage.
(3) The cleaning shall be carried out with solvent below.
Solvent : Ethyl alcohol, Methyl alcohol
Lead pin
Lead terminals of this product have Copper, Nickel, Palladium and Gold plating.
Before usage, please evaluate solder ability with actual conditions and confirm.
The uniformity in color for the lead terminals are not specified.
Storage and management after open
Storage condition : Storage shall be in accordance with the below conditions.
Storage temp. : 5 to 30°C
Storage humidity : 70%RH or less
GP1S396HCP0F
8
Sheet No.: OP13018EN
Parts
This product uses the below parts.
Light detector (Quantity : 1)
Type
Material
Maximum sensitivity
(nm)
Sensitivity
(nm)
Response time
(μs)
Phototransistor
Silicon
(Si)
920
700 to 1200
20
Light emitter (Quantity : 1)
Type
Material
Maximum light emitting
wavelength (nm)
I/O Frequency
(MHz)
Infrared light emitting diode
(non-coherent)
GaAs
940
0.3
Material
Case
Lead frame
Lead frame plating
Black PPA resin
42 Alloy
Au-Pd-Ni-Cu
Others
This product shall not be proof against radiation flux.
GP1S396HCP0F
9
Sheet No.: OP13018EN
Packing Drawing No. CY14941i09
Inner Packing
1) Inner Packaging drawing
2) Inner Packing material : Reel(PS) Carrier tape(PC) Caver tape(PET)
3) Quantity : 2,800pcs./Reel
Outer Packaging
1) Outer Packaging drawing
2) Outer Packing material : Packing case(Corrugated cardboard), Cushioning material(Urethane)
Label(paper), Tape
3) Quantity : 14,000pcs./box
4) The contents of the carton indication conforms to EIAJ C-3 and the following items are indicated.
Model No., Internal production control name, Quantity, Packing date, Corporate name, Country of origin
5) Regular packaged mass : Approximately 500g

GP1S396HCP0F

Mfr. #:
Manufacturer:
Sharp Microelectronics
Description:
Optical Switches, Transmissive, Phototransistor Output SMD Photointerrupter
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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