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AD9432BSTZ-80

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
AD9432
Rev. F | Page 6 of 16
ABSOLUTE MAXIMUM RATINGS
THERMAL CHARACTERISTICS
Table 2.
Parameter Rating
V
DD
6 V
V
CC
6 V
Analog Inputs −0.5 V to V
CC
+ 0.5 V
Digital Inputs −0.5 V to V
DD
+ 0.5 V
VREFIN −0.5 V to V
CC
+ 0.5 V
Digital Output Current 20 mA
Operating Temperature Range −55°C to +125°C
Storage Temperature Range −65°C to +150°C
Maximum Junction Temperature 150°C
Maximum Case Temperature 150°C
Table 3 lists AD9432 thermal characteristics for simulated typical
performance in a 4-layer JEDEC board, horizontal orientation.
Table 3. Thermal Resistance
Package Type θ
JA
θ
JMA
θ
JC
Unit
52-Lead LQFP (ST-52)
No Airflow 50 °C/W
52-Lead TQFP_EP (SV-52-2)
1
2 °C/W
No Airflow 19.3 °C/W
1.0 m/s Airflow 16 °C/W
1
Bottom of package (soldered exposed pad).
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
ESD CAUTION
EXPLANATION OF TEST LEVELS
I 100% production tested.
II 100% production tested at 25°C and sample tested at
specified temperatures.
III Sample tested only.
IV Parameter is guaranteed by design and characterization
testing.
V Parameter is a typical value only.
VI 100% production tested at 25°C; guaranteed by design and
characterization testing for industrial temperature range.
AD9432
Rev. F | Page 7 of 16
PIN CONFIGURATIONS AND FUNCTION DESCRIPTIONS
52
V
CC
51
GND
50
AIN
49
AIN
48
GND
47
V
CC
46
VREFOU
T
45
VREFIN
44
V
CC
43
GND
42
V
CC
41
DNC
40
GND
38
GND
37
V
CC
36
V
CC
33
GND
34
GND
35
GND
39
GND
32
V
DD
31
DGND
30
D0 (LSB)
28
D2
27
D3
29
D1
2
V
CC
3
GND
4
GND
7
ENCODE
6
V
CC
5
V
CC
1
GND
8
ENCODE
9
GND
10
V
CC
12
DGND
13
V
DD
11
GND
NOTES
1. DNC = DO NOT CONNE
C
T.
14
OR
15
D11 (MSB)
16
D10
17
D9
18
D8
19
D7
20
D6
21
DGND
22
V
DD
23
V
DD
24
DGND
25
D5
26
D4
PIN 1
AD9432
TOP VIEW
(Not to Scale)
00587-002
00587-044
PIN 1
AD9432
TOP VIEW
(Not to Scale)
1
GND
2
V
CC
3
GND
4
GND
5
V
CC
6
V
CC
7
ENCODE
8
ENCODE
9
GND
10
V
CC
11
GND
12
DGND
13
V
DD
14
OR
15
D11 (MSB)
16
D10
17
D9
18
D8
19
D7
20
D6
21
DGND
22
V
DD
23
V
DD
24
DGND
25
D5
26
D4
40
GND
41
DNC
42
V
CC
43
GND
44
V
CC
45
VREFIN
46
VREFOUT
47
V
CC
48
GND
49
AIN
50
AIN
51
GND
52
V
CC
27
D3
28
D2
29
D1
30
D0 (LSB)
31
DGND
32
V
DD
33
GND
34
GND
35
GND
36
V
CC
37
V
CC
38
GND
39
GND
NOTES
1. ALTHOUGH NOT REQUIRED IN ALL APPLICATIONS, THE EXPOSED PADDLE
ON THE UNDERSIDE OF THE PACKAGE SHOULD BE SOLDERED TO THE
GROUND PLANE. SOLDERING THE EXPOSED PADDLE TO THE PCB
INCREASES THE RELIABILITY OF THE SOLDER JOINTS, MAXIMIZING
THE THERMAL CAPABILITY OF THE PACKAGE.
Figure 3. Pin Configuration, LQFP Figure 4. Pin Configuration, TQFP_EP
Table 4. Pin Function Descriptions
Pin No. Mnemonic Description
1, 3, 4, 9, 11, 33,
34, 35, 38, 39, 40,
43, 48, 51
GND Analog Ground.
2, 5, 6, 10, 36, 37,
42, 44, 47, 52
V
CC
Analog Supply (5 V).
7
ENCODE
Encode Clock for ADC, Complementary.
8 ENCODE Encode Clock for ADC, True. ADC samples on rising edge of ENCODE.
12, 21, 24, 31 DGND Digital Output Ground.
13, 22, 23, 32 V
DD
Digital Output Power Supply (2.7 V to 3.6 V).
14 OR Out-of-Range Output.
15 to 20, 25 to 30 D11 to D6, D5 to D0 Digital Output.
41 DNC Do Not Connect.
45 VREFIN Reference Input for ADC (2.5 V Typical). Bypass with 0.1 μF capacitor to ground.
46 VREFOUT Internal Reference Output (2.5 V Typical).
49 AIN Analog Input, True.
50
AIN
Analog Input, Complementary.
Exposed Pad
(TQFP_EP)
Although not required in all applications, the exposed paddle on the underside of the TQFP_EP
package should be soldered to the ground plane. Soldering the exposed paddle to the PCB
increases the reliability of the solder joints, maximizing the thermal capability of the package.
AD9432
Rev. F | Page 8 of 16
TYPICAL PERFORMANCE CHARACTERISTICS
90
60
70
65
85
80
75
SNR/SINAD/SFDR (dB)
ENCODE (MSPS)
0 20 40 80 100 120 140 16060
AIN = 10.3MHz
SINAD
SFDR
SNR
00587-009
Figure 5. SNR/SINAD/SFDR vs. f
S
, f
IN
= 10.3 MHz
HARMONICS (dBc)
ENCODE (MSPS)
0 20 40 80 100 120 140 16060
00587-010
–90
–95
–100
–85
–80
–75
–70
–65
–60
–55
–
50
2ND
3RD
AIN = 10.3MHz
Figure 6. Second-Order and Third-Order Harmonics vs. f
S
, f
IN
= 10.3 MHz
SINAD (dB)
ANALOG INPUT FREQUENCY (MHz)
0 20 40 80 100 120 140 200160 18060
00587-011
70
65
60
55
50
45
40
ENCODE = 105MSPS
SINAD (–3.0dBFS)
SINAD (–6.0dBFS)
SINAD (–0.5dBFS)
Figure 7. SINAD vs. f
IN
, f
S
= 105 MSPS
SNR (dB)
ANALOG INPUT FREQUENCY (MHz)
0 50 100 150 250200
00587-012
70
65
60
55
50
AIN = –0.5dBFS
Figure 8. SNR vs. f
IN
, Encode = 105 MSPS
HARMONICS (dBc)
ANALOG INPUT FREQUENCY (MHz)
0 20 40 80 100 120 140 200160 18060
00587-013
100
90
80
70
60
50
40
ENCODE = 105MSPS
2ND or 3RD (–0.5dBFS)
2ND or 3RD (–3.0dBFS)
2ND or 3RD (–6.0dBFS)
Figure 9. Second-Order and Third-Order Harmonics vs. f
IN
, f
S
= 105 MSPS
WORST OTHER (dBc)
ANALOG INPUT FREQUENCY (MHz)
0 20 40 80 100 120 140 200160 18060
00587-014
100
90
80
70
60
50
40
ENCODE = 105MSPS
WORST OTHER (–0.5dBFS)
WORST OTHER (–6.0dBFS)
WORST OTHER (–3.0dBFS)
Figure 10. Worst Other (Excluding Second-Order and Third-Order
Harmonics) vs. f
IN
, f
S
= 105 MSPS
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

AD9432BSTZ-80

Mfr. #:
Buy AD9432BSTZ-80
Manufacturer:
Analog Devices Inc.
Description:
Analog to Digital Converters - ADC IC 12-BIT 80 MSPS
Lifecycle:
New from this manufacturer.
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