MF1SEP_H_10X1_SDS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.1 — 16 March 2017
328631 3 of 17
NXP Semiconductors
MF1SEP(H)10x1
MIFARE PLUS SE - Secure contactless smart card IC
5. Ordering information
Table 2. Ordering information
Type number Package
Commerci
al Name
Name Description Version
MF1SEP1001DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format), 1 kB EEPROM, 7-byte UID, 17 pF input
capacitance
-
MF1SEP1031DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format), 1 kB EEPROM, 4-byte NUID, 17 pF input
capacitance
-
MF1SEP1001DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 7-byte UID, 17 pF input
capacitance
SOT500-2
MF1SEP1031DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 4-byte NUID, 17 pF input
capacitance
SOT500-2
MF1SEP1001DA8/03 MOA8 PLLMC plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 7-byte UID, 17 pF input
capacitance
SOT500-4
MF1SEP1031DA8/03 MOA8 PLLMC plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 4-byte NUID, 17 pF input
capacitance
SOT500-4
MF1SEPH1001DUD/03 FCC - 8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format), 1 kB EEPROM, 7-byte UID, 70 pF input
capacitance
-
MF1SEPH1001DA4/03 MOA4 PLLMC 8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format), 1 kB EEPROM, 7-byte BUID, 70 pF input
capacitance
SOT500-2
MF1SEPH1001DA8/03 MOA8 PLLMC plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 7-byte UID, 70 pF input
capacitance
SOT500-4
MF1SEPH1031DUD/03 FFC - plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 4-byte NUID, 70 pF input
capacitance
-
MF1SEPH1031DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 4-byte NUID, 70 pF input
capacitance
SOT500-2
MF1SEPH1031DA8/03 MOA8 PLLMC plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 4-byte NUID, 70 pF input
capacitance
SOT500-4