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MF1SEP1031DA4/03J

P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17
1. General description
MIFARE Plus is the only mainstream smart card family compatible with MIFARE Classic
1K and MIFARE Classic 4K that offers pre-issuance of cards prior to making security
upgrades in the infrastructure. After security upgrade to Security Level 3, MIFARE Plus
uses Advanced Encryption Standard (AES) for authentication, data integrity, and
encryption.
MIFARE Plus SE is the entry-level version of NXP’s proven and reliable MIFARE Plus
product family. Designed for full functional compatibility with MIFARE Classic 1K, it
provides complete support for the MIFARE Classic value blocks.
MIFARE Plus SE is the choice for customers who want to switch to higher security while
preparing for the future by introducing cards, ready for AES security, into the existing
system environment.
MIFARE Plus SE cards are easy to distribute into running MIFARE Classic systems, since
it uses a linear memory structure compatible to MIFARE Classic, and because MIFARE
Plus SE supports all MIFARE Classic value-block operations in the Security Levels SL1
and SL3. MIFARE Plus SE stores its 128-bit AES keys on top of the data blocks. The
optional AES authentication in SL1 enables efficient detection of cards not belonging to
the system.
2. Features and benefits
MF1SEP(H)10x1
MIFARE PLUS SE - Secure contactless smart card IC for
seamless migration
Rev. 3.1 — 16 March 2017
328631
Product short data sheet
COMPANY PUBLIC
Entry level version of the proven
MIFARE Plus product family
1 kB EEPROM
Simple fixed memory structure
compatible with MIFARE Classic
Fully supports MIFARE Classic value
block operations
AES-128 for authenticity and integrity NXP originality check
Freely configurable access conditions Supports ISO/IEC 14443-3
[1]
UIDs
(4-Byte NUID, 7-byte UID)
Optional support of random IDs Multi-sector authentication, Multi-block
read and write
Anti-tearing mechanism for writing AES
keys
Keys can be stored as MIFARE
CRYPTO1 keys (2 x 48-bit per sector)
and AES keys (2 x 128-bit per sector)
Virtual card concept Communication speed up to 848 kbit/s
Number of single write operations:
200000 typical
Data retention time: 10 years
MF1SEP_H_10X1_SDS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.1 — 16 March 2017
328631 2 of 17
NXP Semiconductors
MF1SEP(H)10x1
MIFARE PLUS SE - Secure contactless smart card IC
[1] ISO/IEC 14443-x used in this data sheet refers to ISO/IEC 14443 Type A.
3. Applications
Public transportation
Access management
Electronic toll collection
Car parking
School and campus cards
Employee cards
Loyalty
Wearables
4. Quick reference data
[1] Measured with LCR meter.
Table 1. Quick reference data
Symbol Parameter Conditions Min Typ Max Unit
C
i
input capacitance T
amb
= 22 C; f
i
= 13.56 MHz;
2.8 V RMS
[1]
15.0 17.0 19.04 pF
T
amb
= 22 C; f
i
= 13.56 MHz;
2.8 V RMS
- 70.0 - pF
f
i
input frequency - 13.56 - MHz
EEPROM characteristics
t
ret
retention time T
amb
= 22 C10--year
N
endu(W)
write endurance T
amb
= 22 C; excluding
anti-tearing for AES keys or
sector trailers in security
level 3
100000 200000 - cycle
MF1SEP_H_10X1_SDS All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2017. All rights reserved.
Product short data sheet
COMPANY PUBLIC
Rev. 3.1 — 16 March 2017
328631 3 of 17
NXP Semiconductors
MF1SEP(H)10x1
MIFARE PLUS SE - Secure contactless smart card IC
5. Ordering information
Table 2. Ordering information
Type number Package
Commerci
al Name
Name Description Version
MF1SEP1001DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format), 1 kB EEPROM, 7-byte UID, 17 pF input
capacitance
-
MF1SEP1031DUD/03 FFC - 8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format), 1 kB EEPROM, 4-byte NUID, 17 pF input
capacitance
-
MF1SEP1001DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 7-byte UID, 17 pF input
capacitance
SOT500-2
MF1SEP1031DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 4-byte NUID, 17 pF input
capacitance
SOT500-2
MF1SEP1001DA8/03 MOA8 PLLMC plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 7-byte UID, 17 pF input
capacitance
SOT500-4
MF1SEP1031DA8/03 MOA8 PLLMC plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 4-byte NUID, 17 pF input
capacitance
SOT500-4
MF1SEPH1001DUD/03 FCC - 8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format), 1 kB EEPROM, 7-byte UID, 70 pF input
capacitance
-
MF1SEPH1001DA4/03 MOA4 PLLMC 8 inch wafer (sawn; 120 µm thickness, on film frame
carrier; electronic fail die marking according to SECS-II
format), 1 kB EEPROM, 7-byte BUID, 70 pF input
capacitance
SOT500-2
MF1SEPH1001DA8/03 MOA8 PLLMC plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 7-byte UID, 70 pF input
capacitance
SOT500-4
MF1SEPH1031DUD/03 FFC - plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 4-byte NUID, 70 pF input
capacitance
-
MF1SEPH1031DA4/03 MOA4 PLLMC plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 4-byte NUID, 70 pF input
capacitance
SOT500-2
MF1SEPH1031DA8/03 MOA8 PLLMC plastic leadless module carrier package; 35 mm wide
tape, 1 kB EEPROM, 4-byte NUID, 70 pF input
capacitance
SOT500-4
P1-P3P4-P6P7-P9P10-P12P13-P15P16-P17

MF1SEP1031DA4/03J

Mfr. #:
Buy MF1SEP1031DA4/03J
Manufacturer:
NXP Semiconductors
Description:
RFID Transponders Secure Contactless Smart Card IC
Lifecycle:
New from this manufacturer.
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