6 Reliability tests
The device passed all reliability tests on three different assembly lots under the following
conditions in the table below.
Table 7: Tests and summary of results
Test name
Description
Conditions
HTOL:
High Temperature
Operating Life
The device is stressed in dynamic configuration, approaching the operative
max. absolute ratings in terms of junction temperature, load current, internal
power dissipation.
Tamb = 125 °C
JESD22a108
HTS:
High Temperature Storage
The device is stored in an unbiased condition at the maximum temperature
allowed by the package materials, sometimes higher than the maximum
operative temperature.
Ta = 125 °C
JESD22a103
PC (JL3):
Preconditioning (solder
simulation)
The device is submitted to a typical temperature profile used for surface
mounting, after controlled moisture absorption
TC:
Temperature Cycling
The device is submitted to cycled temperature excursions, between a hot
and a cold chamber in air atmosphere
Ta Cycling: -40 °C ±125°C
JESD22a104
ESD (HBM):
Electrostatic
Discharge (Human Body Model)
The device is submitted to a high voltage peak on all his pins simulating
ESD stress according to different simulation models.
JEDEC / JESD22-A114E
ESD (MM):
Electrostatic Discharge
(Machine Model
)
JEDEC/JESD-A115-A
ESD (CDM):
Electrostatic
Discharge (Charged Device
Model)
ANSI / ESD STM 5.3.1
ESDA
LU (CI):
Latch-up (Overvoltage
and Current Injection)
The device is submitted to a direct current forced/sunk into the input/output
pins. Removing the direct current, no change in the supply current must be
observed.
Current injection ±200 mA
Overvoltage 1.5 x Vmax
EIA/JESD78
THB:
Temperature Humidity Bias
The device is biased in static configuration minimizing its internal power
dissipation, and stored at controlled conditions for ambient temperature and
relative humidity.
T = 85 ° C / RH = 85%
JESD22a108
LTS:
Low Temperature Storage
The device is stored in an unbiased condition at the min. temperature
allowed by the package materials, sometimes lower than the min. op. temp
JESD22a119
MS:
Mechanical Shock
The device is submitted to 10000 g / 0.1 ms
5 shocks for each axis.
5 shocks for each axis,
under bias
MIL STD 883MIL
