2
IR2085S & (PbF)
www.irf.com
Absolute Maximum Ratings
Absolute maximum ratings indicate sustained limits beyond which damage to the device may occur. All voltage param-
eters are absolute voltages referenced to COM. All currents are defined positive into any lead. The thermal resistance
and power dissipation ratings are measured under board mounted and still air conditions.
Symbol Definition Min. Max. Units
V
b
High side floating supply voltage -0.3 150
V
CC
Low side supply voltage — 25
V
S
High side floating supply offset voltage V
b
- 25 V
b
+ 0.3
V
HO
High side floating output voltage V
b
- 0.3 V
b
+ 0.3
V
LO
Low side output voltage -0.3 V
CC
+ 0.3
OSC OSC pin voltage -0.3 V
CC
+ 0.3
V
CS
Cs pin voltage -0.3 V
CC
+ 0.3
dV
S
/dt Allowable offset voltage slew rate -50 +50 V/ns
I
CC
Supply current — 20 mA
P
D
Package power dissipation
—1.0W
Rth
JA
Thermal resistance, junction to ambient — 200 °C/W
T
J
Junction temperature -55 150
T
S
Storage temperature -55 150
T
L
Lead temperature (soldering, 10 seconds) — 300
°C
Recommended Operating Conditions
For proper operation the device should be used within the recommended conditions.
Vb High side floating supply voltage V
dd
-0.7 15
V
S
Steady state high side floating supply offset voltage -5 100
V
CC
Supply voltage 10 15
I
CC
Supply current (Note 2) — 5 mA
R
T
Timing resistor 10 100 KΩ
C
T
Timing capacitor 47 1000 pF
fosc(max) Operating frequency (per channel) — 500
KHz
T
J
Junction temperature -40 125 °C
Vdc
Symbol Definition Min. Max. Units
Note1: Care should be taken to avoid output switching conditions where the Vs node flies inductively below ground by more
than 5V.
V
