XCR3032XL 32 Macrocell CPLD
DS023 (v2.2) September 15, 2008 www.xilinx.com 9
Product Specification
Warranty Disclaimer
THESE PRODUCTS ARE SUBJECT TO THE TERMS OF THE XILINX LIMITED WARRANTY WHICH CAN BE VIEWED
AT http://www.xilinx.com/warranty.htm
. THIS LIMITED WARRANTY DOES NOT EXTEND TO ANY USE OF THE
PRODUCTS IN AN APPLICATION OR ENVIRONMENT THAT IS NOT WITHIN THE SPECIFICATIONS STATED ON THE
THEN-CURRENT XILINX DATA SHEET FOR THE PRODUCTS. PRODUCTS ARE NOT DESIGNED TO BE FAIL-SAFE
AND ARE NOT WARRANTED FOR USE IN APPLICATIONS THAT POSE A RISK OF PHYSICAL HARM OR LOSS OF
LIFE. USE OF PRODUCTS IN SUCH APPLICATIONS IS FULLY AT THE RISK OF CUSTOMER SUBJECT TO
APPLICABLE LAWS AND REGULATIONS.
Additional Information
CoolRunner XPLA3 CPLD Data Sheets and Application
Notes
Device Packages
Device Package User Guide
Revision History
The following table shows the revision history for this document.
Date Version Revision
11/18/00 1.0 Initial Xilinx release.
02/05/01 1.1 Removed Timing Model.
04/11/01 1.2 Update TSUF spec to meet UMC characterization data. Added Icc vs. Freq. numbers,
Tab l e 1 and updated Figure 1. Added Typical I/V curve, Figure 2; added Tabl e 2: Total User
I/O; changed V
OH
spec.
04/19/01 1.3 Updated Typical I/V curve, Figure 2: added voltage levels.
08/27/01 1.4 Changed from Advance to Preliminary; updated DC Electrical Characteristics; AC Electrical
Characteristics; Internal Timing Parameters; added Derating Curve; added -10 industrial
packages. Added 200 MHz to Figure 1 and Ta bl e 1. changed -5 F
SYSTEM
to 200 MHz, -5 T
F
to 0.5 ns.
01/08/02 1.5 Updated T
HI
spec to correct a typo. Added single p-term setup time (T
SU1
) to AC Table,
renamed T
SU
to T
SU2
for setup time through the OR array. Updated AC Load Circuit diagram
to more closely resemble true test conditions, added note for T
POD
delay
measurement.Updated note 5 in AC Characteristics table lowering typical current draw
during configuration.
01/06/03 1.6 Added voltage and temperature to Figure 2. Increased -5 T
PCO
to 6.0 (from 5.5 ns) by
adding T
PTCK
parameter to internal timing model. Increased -5 F
MAX
. Updated Ordering
Information format.
07/15/03 1.7 Updated Device Part Marking. Updated test conditions for I
IL
and I
IH
.
08/21/03 1.8 Updated Package Device Marking Pin 1 orientation.
02/13/04 1.9 Add solder temperature specification. Add links to data sheets, application notes and
packages.
04/08/05 2.0 Added I
CCSB
Typical and T
APRPW
specifications. Removed T
SOL
specification. Added note
about Pb-free packages.
03/31/06 2.1 Added Warranty Disclaimer; Added Pb-Free ordering information.
09/15/08 2.2 Added notes to tables to indicate PC44 and PCG44 packages are obsolete. Removed part
number references to the obsolete PC44C and PCG44C packages in the Ordering
Combination Information. See Product Discontinuation Notice
xcn07022.pdf.
