NCP370
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3
PIN FUNCTION DESCRIPTION
Pin Name Type Description
1, 2 IN POWER
Input voltage pins. These pins are connected to the power supply. A 1 mF low ESR ceramic capacitor, or
larger, must be connected between these pins and GND. The two IN pins must be hardwired to common
supply.
3 GND POWER Main Ground
4 RES INPUT Reserved pin. This pin must be connected to GND.
5 RES INPUT Reserved pin. This pin must be connected to GND.
6 RES INPUT Reserved pin. This pin must be connected to GND.
7 Ilim OUTPUT Current Limit Pin. This pin provides the reference, based on the internal band−gap voltage reference, to
limit the over current, across internal N−MOSFETs, from battery to external accessory. A 1% tolerance,
or better, resistor shall be used to get the highest accuracy of the overcurrent limit.
8 REV INPUT Reverse Charge Control Pin. In combination with DIR, the internal N−MOSFETs are turned on if Battery
is applied on the OUT pin (See Tables 1 & 2). In reverse mode, the internal overcurrent protection is
activated. When reverse mode is disabled, the NCP370 current consumption, into OUT pin, is drastically
decreased to limit battery discharge.
9 DIR INPUT Direct Mode Pin. In combination with REV, the internal N−MOSFETs are turned on if a wall adapter
AC−DC is applied on the IN pins (See Tables 1 & 2). The device enters in shutdown mode when this pin
is tied to a high level and the REV pin is tied to high. In this case the output is disconnected from input.
The state of this pin does not have an impact on the fault detect of the FLAG pin.
10 FLAG OUTPUT Fault Indication Pin. This pin allows an external system to detect fault condition. The pin goes low when
input voltage exceeds OVLO threshold or drops below UVLO threshold, charge current from battery to
accessory exceeds current limit or internal temperature exceeds thermal shutdown limit. Since the pin is
open drain functionality, an external pull up resistor to VBat must be added (10 kW minimum value).
11 OUT OUTPUT Output Voltage Pin. This pin follows IN pins when “no input fault” is detected. The output is disconnected
from the V
IN
power supply when the input voltage is under the UVLO threshold or above OVLO threshold
or thermal shutdown limit is exceeded.In Reverse Mode, the device is supplied across OUT pin.
12 NC NC Not Connected
13 PAD1 POWER The PAD1 is used to dissipate the internal MOSFET thermal energy and must be soldered to an isolated
PCB area. The area mustn’t be connected to any other potential than complete isolated one. See PCB
recommendations on page 9.
MAXIMUM RATINGS
Rating Symbol Value Unit
Minimum Voltage (IN to GND) Vmin
in
−30 V
Minimum Voltage (All others to GND) Vmin −0.3 V
Maximum Voltage (IN to GND) Vmax
in
30 V
Maximum Voltage (OUT to GND) Vmax
out
10 V
Maximum Voltage (All others to GND) Vmax 7 V
Thermal Resistance, Junction−to−Air, (Note 1)
R
q
JA
200 °C/W
Operating Ambient Temperature Range T
A
−40 to +85 °C
Storage Temperature Range T
STG
−65 to +150 °C
Junction Operating Temperature T
J
150 °C
ESD Withstand Voltage (IEC 61000−4−2)
Human Body Model (HBM), Model = 2, (Note 2)
Machine Model (MM) Model = B, (Note 3)
Vesd 15kV air, 8kV contact
2000V
200V
kV
V
V
Moisture Sensitivity MSL Level 1
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The R
q
JA
is highly dependent on the PCB heat sink area (connected to PAD1). See PCB recommendation paragraph.
2. Human Body Model, 100 pF discharged through a 1.5 kW resistor following specification JESD22/A114.
3. Machine Model, 200 pF discharged through all pins following specification JESD22/A115.
