NCP370
http://onsemi.com
9
At power up (accessory is plugged on input pins), the
current is limited up to I
lim
for 1.2 ms (typical), to allow
capacitor charge and limit inrush current. If the I
lim
threshold is exceeded over 1.2 ms, the device enters
OCP burst mode until the overcurrent event disappears.
After 1 ms following the plug in of the accessory, the OCP
mode is engaged. See Figure 6.
tstart
REV
Figure 6. Overcurrent Protection Sequence
V
in
REV
DIR
FLAG
V
out
I
lim
Drive Current in Accessory
ID
I
REV
Accessory ID
Detection
t
REG
t
RRD
ton
REV
Thermal Shutdown Protection
In case of internal overheating, the integrated thermal
shutdown protection turns off the internal MOSFETs in
order to instantaneously decrease the device temperature.
The thermal threshold has been set at 150°C FLAG then
goes low to inform the MCU.
As the thermal hysteresis is 30°C, the MOSFETs will turn
on as soon the device temperature falls below 120°C.
If the fault event is still present, the temperature increase
engages the thermal shutdown again until the fault event
disappears.
PCB Recommendations
Since the NCP370 integrates the 1. 3A N−MOSFETs,
PCB rules must be respected to properly evacuate the heat
out of the silicon.
From an applications standpoint, PAD1 of the NCP370
package should be connected to an isolated PCB area to
increase the heat transfer if necessary.
In any case, PAD1 should be not connected to any other
potential or GND other than the isolated extra copper
surface.
To assist in the design of the transfer plane connected to
PAD1, Figure 7 shows the copper area required with respect
to R
q
JA
.