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SFH 4250-S

P1-P3P4-P6P7-P9P10-P12P13-P13
 2
Version 1.9 SFH 4250S
Max. Permissible Forward Current
I
F, max
= f(T
A
), R
thJA
= 300 K / W, R
thJS
= 140 K / W
Forward Current
9<page 12
I
F
= f(V
F
), single pulse, t
p
= 100 µs, T
A
= 25°C
Permissible Pulse Handling Capability
I
F
= f(t
p
), T
A
= 25 °C, duty cycle D = parameter
Permissible Pulse Handling Capability
I
F
= f (τ), T
A
= 85 °C, duty cycle D = parameter
0
0
˚C
T
A
F
I
mA
OHF05696
20 40 60 80 100
20
40
60
80
100
120
T
S
,
thJS
R
thJA
R
OHF05579
F
I
V
mA
2
F
V
5
10
2
5
10
3
10
1
10
0
3 4 5
t
p
0
T
t
A
I
F
D
=
I
P
T
F
P
t
OHF05697
-5
10
-3-4
10 10
-1-2
10 10
10
10 10 s
2
10
0.5
1
0.2
0.1
0.01
0.05
0.02
=
0.005
D
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
1010
0
-2-3-4-5
1010 10
F
I
A
P
t
=
D
T
210-1
10
t
p
10 s10
OHF04491
T
t
P
I
F
0.05
0.10
0.15
0.20
0.25
0.30
0.35
0.40
0.45
0.50
0.55
0.60
0.75
0.02
0.1
0.05
0.5
0.2
1
0.01
0.005
D
=
Version 1.9 SFH 4250S
 1
Radiation Characteristics
9<page 12
I
rel
= f(ϕ), T
A
= 25°C
Package Outline
Dimensions in mm (inch).
 0
Version 1.9 SFH 4250S
Pinning
Pin Description
&
%
9 %
2 %
Package
Power TOPLED
Approximate Weight:
31 mg
Recommended Solder Pad
Reflow Soldering
Dimensions in mm (inch).
OHFP3021
Padgeometrie für
verbesserte Wärmeableitung
improved heat dissipation
Paddesign for
Lötstoplack
Solder resist
0.8 (0.031)
3.7 (0.146)
1.1 (0.043)
2.3 (0.091)
3.3 (0.130)
1.5 (0.059)
11.1 (0.437)
Cu Fläche / 16 mm per pad
2
Cu-area
_
<
3.3 (0.130)
0.7 (0.028)
P1-P3P4-P6P7-P9P10-P12P13-P13

SFH 4250-S

Mfr. #:
Buy SFH 4250-S
Manufacturer:
Description:
POWER TOPLED
Lifecycle:
New from this manufacturer.
Delivery:
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