Version 1.9 SFH 4250S
 3
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
0
0
s
OHA04525
50
100
150
200
250
300
50 100 150 200 250 300
t
T
˚C
S
t
t
P
t
T
p
240 ˚C
217 ˚C
245 ˚C
25 ˚C
L
OHA04612
Profile Feature
Profil-Charakteristik
Ramp-up rate to preheat*
)
25 °C to 150 °C
2 3 K/s
Time t
S
T
Smin
to T
Smax
t
S
t
L
t
P
T
L
T
P
100 12060
10 20 30
80 100
217
2 3
245 260
3 6
Time
25 °C to T
P
Time within 5 °C of the specified peak
temperature T
P
- 5 K
Ramp-down rate*
T
P
to 100 °C
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Ramp-up rate to peak*
)
T
Smax
to T
P
Liquidus temperature
Peak temperature
Time above liquidus temperature
Symbol
Symbol
Unit
Einheit
Pb-Free (SnAgCu) Assembly
Minimum MaximumRecommendation
K/s
K/s
s
s
s
s
°C
°C
480

Version 1.9 SFH 4250S
Taping
Dimensions in mm (inch).
Tape and Reel
8 mm tape with 2000 pcs. on ∅ 180 mm reel, 8000 pcs. on ∅ 330 mm reel
D
0
2
P
P
0
1
P
W
F E
Direction of unreeling
N
W
1
2
W
A
OHAY0324
Label
Leader:
Trailer:
13.0
Direction of unreeling
±0.25
min. 160 mm *
min. 400 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
Version 1.9 SFH 4250S
 O
Tape dimensions [mm]
Tape dim ensions in m m
Reel dimensions [mm]
Reel dim ensions in m m
Reel dim ensions in m m
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
DS
C!!!+#!#.! .-
(.#. -.! +
!E&-
W
P
0
P
1
P
2
D
0
E F
T-96- 2N- N-1

2N-
N-1 -1N- -31N- 9-1N-1
A W
N
min
W
1
W
2max
 0 -2T 2-2
A W
N
min
W
1
W
2max
99 0 -2T 2-2
OHA00539
OSRAM
Moisture-sensitive label or print
Barcode label
Desiccant
Humidity indicator
Barcode label
OSRAM
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
WET
Do not eat.
Comparator
check dot
parts still adequately dry.
examine units, if necessary
examine units, if necessary
5%
15%
10%
bake units
bake units
If wet,
change desiccant
If wet,
Humidity Indicator
MIL-I-8835
If wet,
Moisture Level 3
Floor time 168 Hours
Moisture Level 6
Floor time 6 Hours
a) Humidity Indicator Card is > 10% when read at 23 ˚C ± 5 ˚C, or
reflow, vapor-phase reflow, or equivalent processing (peak package
2. After this bag is opened, devices that will be subjected to infrared
1. Shelf life in sealed bag: 24 months at < 40 ˚C and < 90% relative humidity (RH).
Moisture Level 5a
at factory conditions of
(if blank, seal date is identical with date code).
a) Mounted within
b) Stored at
body temp.
3. Devices require baking, before mounting, if:
Bag seal date
Moisture Level 1
Moisture Level 2
Moisture Level 2a
4. If baking is required,
b) 2a or 2b is not met.
Date and time opened:
reference IPC/JEDEC J-STD-033 for bake procedure.
Floor time see below
If blank, see bar code label
Floor time > 1 Year
Floor time 1 Year
Floor time 4 Weeks
10% RH.
_
<
Moisture Level 4
Moisture Level 5
˚C).
OPTO SEMICONDUCTORS
MOISTURE SENSITIVE
This bag contains
CAUTION
Floor time 72 Hours
Floor time 48 Hours
Floor time 24 Hours
30 ˚C/60% RH.
_
<
LEVEL
If blank, see
bar code label

SFH 4250-S

Mfr. #:
Manufacturer:
Description:
POWER TOPLED
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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