NCP81245
www.onsemi.com
24
PACKAGE DIMENSIONS
CASE 485BE
ISSUE B
SEATING
NOTE 4
K
0.10 C
(A3)
A
A1
D2
b
1
14
27
52
E2
52X
L
BOTTOM VIEW
DETAIL C
TOP VIEW
SIDE VIEW
D
A B
E
0.10
C
PIN ONE
LOCATION
0.10 C
0.08 C
C
40
e
A0.07 BC
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSIONS: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL TIP
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
DIM MIN MAX
MILLIMETERS
A 0.80 1.00
A1 0.00 0.05
A3 0.20 REF
b 0.15 0.25
D 6.00 BSC
D2 4.60 4.80
E 6.00 BSC
4.80E2 4.60
e 0.40 BSC
L 0.25 0.45
L1 0.00 0.15
NOTE 3
PLANE
DIMENSIONS: MILLIMETERS
0.25
4.80
0.40
4.80
52X
0.63
52X
6.40
6.40
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DETAIL B
L1
DETAIL A
L
ALTERNATE TERMINAL
CONSTRUCTIONS
L
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATE
CONSTRUCTION
K 0.30 REF
PITCH
52X
PKG
OUTLINE
L2 0.15 REF
L2
DETAIL C
8 PLACES
L2
DETAIL A
DETAIL D
8 PLACES
0.11
0.49
DETAIL D
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