LTC3538
15
3538fb
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
3.00 ±0.10
(2 SIDES)
2.00 ±0.10
(2 SIDES)
NOTE:
1. DRAWING IS NOT A JEDEC PACKAGE OUTLINE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
TOP AND BOTTOM OF PACKAGE
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
0.75 ±0.05
R = 0.115
TYP
R = 0.05
TYP
1.35 REF
1
4
85
PIN 1 BAR
TOP MARK
(SEE NOTE 6)
0.200 REF
0.00 – 0.05
(DCB8) DFN 0106 REV A
0.23 ± 0.05
0.45 BSC
PIN 1 NOTCH
R = 0.20 OR 0.25
× 45° CHAMFER
0.25 ± 0.05
1.35 REF
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.10 ±0.05
0.70 ±0.05
3.50 ±0.05
PACKAGE
OUTLINE
0.45 BSC
1.35 ±0.10
1.35 ±0.05
1.65 ± 0.10
1.65 ± 0.05
DCB Package
8-Lead Plastic DFN (2mm × 3mm)
(Reference LTC DWG # 05-08-1718 Rev A)
