374724B00032G

DATASHEET
BoardLevelCooling3747
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122

MECHANICAL&PERFORMANCE
Drawingdimensionsareshowninmm,(in)
BOARDLEVELCOOLING3747
37472isaseriesofsquarepinfinboardlevelheatsinksdesignedtocoolBGA
andFPGAdevices.Representativeimageonly.
ORDERINGINFORMATION
PartNumber DeviceType
374724B00032G BGA,FPGA
374724B00035G BGA,FPGA
374724B60024G BGA,FPGA
PartNumber:374724B00032G,374724B00035G
Property Details
HeatSinkWidth(mm) 35.00
HeatSinkLength(mm) 35.00
HeatSinkHeight(mm) 18.00
HeatSinkMountingDirection Horizontal,Vertical
HEATSINKDETAILS
Property Details
Material Aluminum
Finish BlackAnodize
DeviceAttachmentOptions:
374724B00032G
Tape
DeviceAttachmentOptions:
374724B00035G
Tape
DeviceAttachmentOptions
374724B60024G
SolderAnchorClip
ThermalInterfaceMaterial:
374724B00032G
T405RChomericsTapeforMetal
Surfaces
ThermalInterfaceMaterial:
374724B00035G
T411ChomericsTapeforAllSurfaces
ThermalInterfaceMaterial:
374724B60024G
T766ChomericsPhaseChangeforAll
Surfaces
DATASHEET
BoardLevelCooling3747
USA:1.855.322.2843 BoardLevelCooling
EUROPE:39.051.764002 www.aavid.com
ASIA:86.21.6115.2000x8122
PartNumber:374724B60024G
MountingDetails:

374724B00032G

Mfr. #:
Manufacturer:
Aavid, Thermal Division of Boyd Corporation
Description:
Heat Sinks Heatsink for Metal/Ceramic BGA Packages, Black Anodized, 35x35x18mm, IC Pkg Size = 35 x 35, Tape #32
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union

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