1EDI30I12MHXUMA1 Datasheet 1EDI30I12MHXUMA1, 1EDI10I12MHXUMA1, 1EDI20I12MHXUMA1 | P16-P18

5 Package Outline

0.252

0.104

0.020

0.013

0.417

0.299

0.035

0.018

MILLIMETERS

ccc

ddd

DIM

MIN

0.020

0.004

0.010

2.45

MAX

INCHES

0.050 BSC

0.244

MIN

0.089

0.012

0.009

0.394

0.291

MAX

0.096

SCALE

4mm

2.25

2.65

0.50

0.32

6.40

10.60

7.607.40

10.00

6.20

0.23

0.30

0.900.50

0.450.25

0.25

0.10

1.27 BSC

ISSUE DATE

05.11.2015

DOCUMENT NO.

Z8B00179262

EUROPEAN PROJECTION

REVISION

A1 0.20 0.004 0.0080.10



 



L2 0.25 BSC

0.010 BSC

Figure 8 PG-DSO-8-59 (Plastic (Green) Dual Small Outline Package)

EiceDRIVER

™

1EDI Compact

Single channel IGBT gate driver IC with clamp in wide body package

Package Outline

Datasheet 16 Rev. 2.0

2016-07-05

6 Application Notes

6.1 Reference Layout for Thermal Data

Figure 9 Reference Layout for Thermal Data (Copper thickness 35 μm)

This PCB layout represents the reference layout used for the thermal characterization.

Pin 4 (GND1) and pin 5 (GND2) require each a ground plane of 100 mm² for achieving maximum power

dissipation. The package is built to dissipate most of the heat generated through these pins.

The thermal

coeicient junction-top (Ψ

th,jt

) can be used to calculate the junction temperature at a given top

case temperature and driver power dissipation:

6.2 Printed Circuit Board Guidelines

The following factors should be taken into account for an optimum PCB layout.

•

Suicient spacing should be kept between high voltage isolated side and low voltage side circuits.

• The same minimum distance between two adjacent high-side isolated parts of the PCB should be

maintained to increase the eective isolation and to reduce parasitic coupling.

• In order to ensure low supply ripple and clean switching signals, bypass capacitor trace lengths should be

kept as short as possible.

Revision History

Page or Item

Subjects (major changes since previous revision)

Rev. 2.0, 2016-07-05

Logic Input extended description of VCC1 scaled input thresholds

Rev. 1.0, 2016-04-14

el. Parameters missing product parameters updated

Rev. 0.51, 2015-11-05

all pages change of template, standardized package drawing included

Rev. 0.50, 2014-05-06

all pages initial version

EiceDRIVER

™

1EDI Compact

Single channel IGBT gate driver IC with clamp in wide body package

Application Notes

Datasheet 17 Rev. 2.0

2016-07-05

Trademarks of Infineon Technologies AG

µHVIC

™

, µIPM

™

, µPFC

™

, AU-ConvertIR

™

, AURIX

™

, C166

™

, CanPAK

™

, CIPOS

™

, CIPURSE

™

, CoolDP

™

, CoolGaN

™

, COOLiR

™

, CoolMOS

™

, CoolSET

™

, CoolSiC

™

, DAVE

™

DI-POL

™

, DirectFET

™

, DrBlade

™

, EasyPIM

™

, EconoBRIDGE

™

, EconoDUAL

™

, EconoPACK

™

, EconoPIM

™

, EiceDRIVER

™

, eupec

™

, FCOS

™

, GaNpowIR

™

, HEXFET

™

HITFET

™

, HybridPACK

™

, iMOTION

™

, IRAM

™

, ISOFACE

™

, IsoPACK

™

, LEDrivIR

™

, LITIX

™

, MIPAQ

™

, ModSTACK

™

, my-d

™

, NovalithIC

™

, OPTIGA

™

, OptiMOS

™

, ORIGA

™

PowIRaudio

™

, PowIRStage

™

, PrimePACK

™

, PrimeSTACK

™

, PROFET

™

, PRO-SIL

™

, RASIC

™

, REAL3

™

, SmartLEWIS

™

, SOLID FLASH

™

, SPOC

™

, StrongIRFET

™

SupIRBuck

™

, TEMPFET

™

, TRENCHSTOP

™

, TriCore

™

, UHVIC

™

, XHP

™

, XMC

™

Trademarks Update 2015-12-22

Other Trademarks

All referenced product or service names and trademarks are the property of their respective owners.

Edition 2016-07-05

Published by

Infineon Technologies AG

81726 Munich, Germany

2016 Infineon Technologies AG

Do you have a question about any

aspect of this document?

Email: erratum@infineon.com

Document reference

IFX-sch1433998947775

IMPORTANT NOTICE

The information given in this document shall in no

event be regarded as a guarantee of conditions or

characteristics (“Beschaenheitsgarantie”) .

With respect to any examples, hints or any typical

values stated herein and/or any information regarding

the application of the product, Infineon Technologies

hereby disclaims any and all warranties and liabilities of

any kind, including without limitation warranties of

non-infringement of intellectual property rights of any

third party.

In addition, any information given in this document is

subject to customer’s compliance with its obligations

stated in this document and any applicable legal

requirements, norms and standards concerning

customer’s products and any use of the product of

Infineon Technologies in customer’s applications.

The data contained in this document is exclusively

intended for technically trained

sta. It is the

responsibility of customer’s technical departments to

evaluate the suitability of the product for the intended

application and the completeness of the product

information given in this document with respect to such

application.

Please note that this product is not qualified

according to the AEC Q100 or AEC Q101 documents

of the Automotive Electronics Council.

WARNINGS

Due to technical requirements products may contain

dangerous substances. For information on the types

in question please contact your nearest Infineon

Technologies

oice.

Except as otherwise explicitly approved by Infineon

Technologies in a written document signed by

authorized representatives of Infineon Technologies,

Infineon Technologies’ products may not be used in

any applications where a failure of the product or

any consequences of the use thereof can reasonably

be expected to result in personal injury

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1EDI30I12MHXUMA1

Mfr. #:

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Manufacturer:

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Description:

Gate Drivers

Lifecycle:

New from this manufacturer.

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1EDI30I12MHXUMA1

1EDI30I12MHXUMA1

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