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DG3000DB-T1-E1

P1-P3P4-P6P7-P9P10-P12P13-P14
Document Number: 63270 www.vishay.com
Revision: 13-Jun-11 1
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
Package Information
Vishay Siliconix
MICRO FOOT: 6-BUMP (3 mm x 2 mm, 0.5 mm PITCH, 165 μm BUMP HEIGHT)
Notes
(unless otherwise specified)
a. Bump is Eutectic 63/57 Sn/Pb or lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser mark on silicon die back; no coating. Shown is not actual marking; sample only.
Note
a. Use millimeters as the primary measurement.
Note
a. Use millimeters as the primary measurement.
Index-Bump A1
Note c
Top Side (Die Back)
XXX
3003
Recommended Land Pattern
0.5
0.5
6 x Ø 0.150
~ 0.229
Note b
Solder Mask Ø
~ Pad Dia. + 0.1
Silicon
Bump
Note a
b Diameter
321
A
B
e
D
e
A
A
2
A
1
S
S
E
EUTECTIC (Sn/Pb)
DIM.
MILLIMETERS
a
INCHES
MIN. MAX. MIN. MAX.
A 0.610 0.685 0.0240 0.0270
A
1
0.140 0.190 0.0055 0.0075
A
2
0.470 0.495 0.0185 0.0195
b 0.180 0.250 0.0071 0.0098
D 1.490 1.515 0.0587 0.0596
E 0.990 1.015 0.0390 0.0400
e 0.5 BASIC 0.0197 BASIC
S 0.245 0.258 0.0096 0.0101
LEAD (Pb)-FREE (Sn/Ag/Cu)
DIM.
MILLIMETERS
a
INCHES
MIN. MAX. MIN. MAX.
A 0.688 0.753 0.0271 0.0296
A
1
0.218 0.258 0.0086 0.0102
A
2
0.470 0.495 0.0185 0.0195
b 0.306 0.346 0.0120 0.0136
D 1.490 1.515 0.0587 0.0596
E 0.990 1.015 0.0390 0.0400
e 0.5 BASIC 0.0197 BASIC
S 0.245 0.258 0.0096 0.0101
ECN: S11-1065-Rev. A, 13-Jun-11
DWG: 6003
AN824
Vishay Siliconix
Document Number: 71990
06-Jan-03
www.vishay.com
1
PCB Design and Assembly Guidelines
For MICRO FOOTr Products
Johnson Zhao
INTRODUCTION
Vishay Siliconix’s MICRO FOOT product family is based on a
wafer-level chip-scale packaging (WL-CSP) technology that
implements a solder bump process to eliminate the need for an
outer package to encase the silicon die. MICRO FOOT
products include power MOSFETs, analog switches, and
power ICs.
For battery powered compact devices, this new packaging
technology reduces board space requirements, improves
thermal performance, and mitigates the parasitic effect typical
of leaded packaged products. For example, the 6−bump
MICRO FOOT Si8902EDB common drain power MOSFET,
which measures just 1.6 mm x 2.4 mm, achieves the same
performance as TSSOP−8 devices in a footprint that is 80%
smaller and with a 50% lower height profile (Figure 1). A
MICRO FOOT analog switch, the 6−bump DG3000DB, offers
low charge injection and 1.4 W on−resistance in a footprint
measuring just 1.08 mm x 1.58 mm (Figure 2).
Vishay Siliconix MICRO FOOT products can be handled with
the same process techniques used for high-volume assembly
of packaged surface-mount devices. With proper attention to
PCB and stencil design, the device will achieve reliable
performance without underfill. The advantage of the device’s
small footprint and short thermal path make it an ideal option
for space-constrained applications in portable devices such as
battery packs, PDAs, cellular phones, and notebook
computers.
This application note discusses the mechanical design and
reliability of MICRO FOOT, and then provides guidelines for
board layout, the assembly process, and the PCB rework
process.
FIGURE 1. 3D View of MICRO FOOT Products Si8902DB and
Si8900EDB
FIGURE 2. Outline of MICRO FOOT CSP & Analog
Switch DG3000DB
0.18 ~ 0.25
321
A
B
0.5
1.58
0.5
0.285
0.285
1.08
AN824
Vishay Siliconix
www.vishay.com
2
Document Number: 71990
06-Jan-03
TABLE 1
Main Parameters of Solder Bumps in MICRO FOOT Designs
MICRO FOOT CSP Bump Material Bump Pitch* Bump Diameter* Bump Height*
MICRO FOOT CSP MOSFET
Eutectic Solder:
0.8 0.37-0.41 0.26-0.29
MICRO FOOT CSP Analog Switch
Eutectic Solder:
63Sm
/
37Pb
0.5 0.18-0.25 0.14-0.19
MICRO FOOT UCSP Analog Switch
63Sm/37Pb
0.5 0.32-0.34 0.21-0.24
* All measurements in millimeters
MICRO FOOT’S DESIGN AND RELIABILITY
As a mechanical, electrical, and thermal connection between
the device and PCB, the solder bumps of MICRO FOOT
products are mounted on the top active surface of the die.
Table 1 shows the main parameters for solder bumps used in
MICRO FOOT products. A silicon nitride passivation layer is
applied to the active area as the last masking process in
fabrication,ensuring that the device passes the pressure pot
test. A green laser is used to mark the backside of the die
without damaging it. Reliability results for MICRO FOOT
products mounted on a FR-4 board without underfill are shown
in Table 2.
TABLE 2
MICRO FOOT Reliability Results
Test Condition C: −65_ to 150_C >500 Cycles
Test condition B: −40_ to 125_ C >1000 Cycles
121_C @ 15PSI 100% Humidity Test 96 Hours
The main failure mechanism associated with wafer-level
chip-scale packaging is fatigue of the solder joint. The results
shown in Table 2 demonstrate that a high level of reliability can
be achieved with proper board design and assembly
techniques.
BOARD LAYOUT GUIDELINES
Board materials. Vishay Siliconix MICRO FOOT products are
designed to be reliable on most board types, including organic
boards such as FR-4 or polyamide boards. The package
qualification information is based on the test on 0.5-oz. FR-4
and polyamide boards with NSMD pad design.
Land patterns. Two types of land patterns are used for
surface-mount packages. Solder mask defined (SMD) pads
have a solder mask opening smaller than the metal pad
(Figure 3), whereas on-solder mask defined (NSMD) pads
have a metal pad smaller than the solder-mask opening
(Figure 4).
NSMD is recommended for copper etch processes, since it
provides a higher level of control compared to SMD etch
processes. A small-size NSMD pad definition provides more
area (both lateral and vertical) for soldering and more room for
escape routing on the PCB. By contrast, SMD pad definition
introduces a stress
concentration point near the solder mask
on the PCB side that may result in solder joint cracking under
extreme fatigue conditions.
Copper pads should be finished with an organic solderability
preservative (OSP) coating. For electroplated
nickel-immersion gold finish pads, the gold thickness must be
less than 0.5 mm to avoid solder joint embrittlement.
FIGURE 3. SMD FIGURE 4. NSMD
Copper
Solder Mask
Copper
Solder Mask
P1-P3P4-P6P7-P9P10-P12P13-P14

DG3000DB-T1-E1

Mfr. #:
Buy DG3000DB-T1-E1
Manufacturer:
Vishay
Description:
IC SWITCH SPST 6-MICRO FOOT
Lifecycle:
New from this manufacturer.
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