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DG3000DB-T1-E1

P1-P3P4-P6P7-P9P10-P12P13-P14
Document Number: 71742
S-70853–Rev. F, 30-Apr-07
www.vishay.com
7
Vishay Siliconix
DG3000
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Product is End of Life
TEST CIRCUITS
Figure 1. Switching Time
Switch
Input
C
L
(includes fixture and stray capacitance)
V+
IN
NO or NC
C
L
35 pF
COM
Logic
Input
R
L
300 Ω
V
OUT
GND
V+
50 %
0 V
Logic
Input
Switch
Output
t
ON
t
OFF
Logic "1" = Switch On
Logic input waveforms inverted for switches that have
the opposite logic sense.
Switch Output
0.9 x V
OUT
t
r
< 5 ns
t
f
< 5 ns
V
INH
V
INL
V
OUT
=V
COM
R
L
R
L
+R
ON
Figure 2. Break-Before-Make Interval
C
L
(includes fixture and stray capacitance)
NC
V
NO
NO
V
NC
0 V
Logic
Input
Switch
Output
V
O
V
NC
= V
NO
t
r
< 5 ns
t
f
< 5 ns
90 %
t
D
t
D
IN
COM
V+
GND
V+
C
L
35 pF
V
O
R
L
300 Ω
V
INH
V
INL
Figure 3. Charge Injection
www.vishay.com
8
Document Number: 71742
S-70853–Rev. F, 30-Apr-07
Vishay Siliconix
DG3000
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Product is End of Life
TEST CIRCUITS
Figure 4. Off-Isolation
IN
GND
NC or NO
0 V, 2.4 V
10 nF
COM
Off Isolation 20 log
V
COM
V
NO/ NC
R
L
Analyzer
V+
V+
=
Figure 5. Channel Off/On Capacitance
NC or NO
f = 1 MHz
IN
COM
GND
0 V, 2.4 V
Meter
HP4192A
Impedance
Analyzer
or Equivalent
10 nF
V+
V+
Document Number: 71742
S-70853–Rev. F, 30-Apr-07
www.vishay.com
9
Vishay Siliconix
DG3000
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Product is End of Life
PACKAGE OUTLINE
MICRO FOOT: 6-BUMP (3 x 2, 0.5 mm PITCH)
Notes (Unless Otherwise Specified):
a. Bump is Eutectic 63/57 Sn/Pb or Lead (Pb)-free Sn/Ag/Cu.
b. Non-solder mask defined copper landing pad.
c. Laser Mark on silicon die back; no coating. Shown is not actual marking; sample only.
Notes:
a. Use millimeters as the primary measurement.
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?71742
.
Index-Bump A1
Note c
Top Side (Die Back)
XXX
3000
Recommended Land Pattern
0.5
0.5
6 x Ø 0.150
∼ 0.229
Note b
Solder Mask Ø
∼ Pad Dia. + 0.1
Silicon
Bump
Note a
b Diameter
321
A
B
e
D
e
A
A
2
A
1
S
S
E
EUTECTIC (Sn/Pb)
Dim.
Millimeters
a
Inches
Min. Max. Min. Max.
A 0.615 0.715 0.0242 0.0281
A
1
0.140 0.190 0.0055 0.0075
A
2
0.470 0.495 0.0185 0.0195
b 0.180 0.250 0.0071 0.0098
D 1.555 1.585 0.0612 0.0624
E 1.055 1.085 0.0415 0.0427
e 0.5 BASIC 0.0197 BASIC
S 0.278 0.293 0.0109 0.0115
LEAD (Pb)-FREE (Sn/Ag/Cu)
Dim.
Millimeters
a
Inches
Min. Max. Min. Max.
A 0.688 0.753 0.0271 0.0296
A
1
0.218 0.258 0.0086 0.0102
A
2
0.470 0.495 0.0185 0.0195
b 0.306 0.346 0.0120 0.0136
D 1.555 1.585 0.0612 0.0624
E 1.055 1.085 0.0415 0.0427
e 0.5 BASIC 0.0197 BASIC
S 0.278 0.293 0.0109 0.0115
P1-P3P4-P6P7-P9P10-P12P13-P14

DG3000DB-T1-E1

Mfr. #:
Buy DG3000DB-T1-E1
Manufacturer:
Vishay
Description:
IC SWITCH SPST 6-MICRO FOOT
Lifecycle:
New from this manufacturer.
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