LTC6404
25
6404f
APPLICATIONS INFORMATION
The LTC6404’s input referred voltage noise contributes the
equivalent noise of a 140Ω resistor. When the feedback
network is comprised of resistors whose values are less
than this, the LTC6404’s output noise is voltage noise
dominant (See Figure 10.):
ee
R
R
no ni
F
I
≈+
•1
Feedback networks consisting of resistors with values
greater than about 200Ω will result in output noise which
is resistor noise and amplifi er current noise dominant.
eIR
R
R
kTR
no n F
F
I
F
()
++
214
2
••
Lower resistor values (<100Ω) always result in lower noise
at the penalty of increased distortion due to increased load-
ing of the feedback network on the output. Higher resistor
values (but still less than 400Ω) will result in higher output
noise, but improved distortion due to less loading on the
output. The optimal feedback resistance for the LTC6404
runs between 100Ω to 400Ω. Higher resistances are not
recommended.
The differential fi ltered outputs OUTF
+
and OUTF
will have
a little higher spot noise than the unfi ltered outputs (due to
the two 50Ω resistors which contribute 0.9nV/√Hz each),
but actually will provide superior Signal-to-Noise in noise
bandwidths exceeding 139MHz due to the noise-fi ltering
function the fi lter provides.
Layout Considerations
Because the LTC6404 is a very high speed amplifi er, it is
sensitive to both stray capacitance and stray inductance.
Three pairs of power supply pins are provided to keep the
power supply inductance as low as possible to prevent
degradation of amplifi er 2nd Harmonic performance. It is
critical that close attention be paid to supply bypassing. For
single supply applications (Pins 3, 9 and 12 grounded) it
is recommended that 3 high quality 0.1µF surface mount
ceramic bypass capacitor be placed between pins 2 and
3, between pins 11and 12, and between pins10 and 9 with
direct short connections. Pins 3, 9 and 10 should be tied
directly to a low impedance ground plane with minimal
routing. For dual (split) power supplies, it is recommended
that at least two additional high quality, 0.1µF ceramic
capacitors are used to bypass pin V
+
to ground and V
to
ground, again with minimal routing. For driving large loads
(<200Ω), additional bypass capacitance may be needed for
optimal performance. Keep in mind that small geometry
(e.g. 0603) surface mount ceramic capacitors have a much
higher self resonant frequency than do leaded capacitors,
and perform best in high speed applications.
Any stray parasitic capacitances to ground at the sum-
ming junctions IN
+
, and IN
should be kept to an absolute
minimum even if it means stripping back the ground plane
away from any trace attached to this node. This becomes
especially true when the feedback resistor network uses
resistor values >400Ω in circuits with R
F
= R
I
. Excessive
peaking in the frequency response can be mitigated by add-
ing small amounts of feedback capacitance (0.5pF to 2pF)
around R
F
. Always keep in mind the differential nature of
the LTC6404, and that it is critical that the load impedances
seen by both outputs (stray or intended) should be as bal-
anced and symmetric as possible. This will help preserve
the natural balance of the LTC6404, which minimizes the
generation of even order harmonics, and preserves the
rejection of common mode signals and noise.
It is highly recommended that the V
OCM
pin be either hard
tied to a low impedance ground plane (in split supply
applications), or bypassed to ground with a high quality
ceramic capacitor whose value exceeds 0.01µF. This will
help stabilize the common mode feedback loop as well as
prevent thermal noise from the internal voltage divider and
Figure 10. LTC6404-1 Output Spot Noise vs Spot Noise
Contributed by Feedback Network Alone
R
F
= R
I
()
10
0.1
nV/√Hz
1
10
100
100 1k 10k
6404 F10
FEEDBACK RESISTOR
NETWORK NOISE ALONE
TOTAL (AMPLIFIER AND
FEEDBACK NETWORK)
OUTPUT NOISE
LTC6404
26
6404f
APPLICATIONS INFORMATION
Figure 11. Interfacing the LTC6404-1 to a High Speed 105Msps ADC
other external sources of noise from being converted to
differential noise due to divider mismatches in the feedback
networks. It is also recommended that the resistive feed-
back networks be comprised of 1% resistors (or better)
to enhance the output common mode rejection. This will
also prevent V
OCM
referred common mode noise of the
common mode amplifi er path (which cannot be fi ltered)
from being converted to differential noise, degrading the
differential noise performance.
Feedback factor mismatch has a weak effect on distortion.
Using 1% or better resistors should prevent mismatch
from impacting amplifi er linearity. However, in single
supply level shifting applications where there is a voltage
difference between the input common mode voltage and
the output common mode voltage, resistor mismatch can
make the apparent voltage offset of the amplifi er appear
worse than specifi ed.
In general, the apparent input referred offset induced by
feedback factor mismatch is given by the equation:
V
OSDIFF(APPARENT)
≈ (V
INCM
– V
OCM
) • Δβ
where
Δβ =
++
R
RR
R
RR
I
IF
I
IF
2
22
1
11
Interfacing the LTC6404 to A/D Converters
The LTC6404’s rail-to-rail output and fast settling time make
the LTC6404 ideal for interfacing to low voltage, single
supply, differential input ADCs. The sampling process of
ADCs create a sampling glitch caused by switching in the
sampling capacitor on the ADC front end which momentarily
“shorts” the output of the amplifi er as charge is transferred
between the amplifi er and the sampling cap. The amplifi er
must recover and settle from this load transient before
this acquisition period ends for a valid representation of
the input signal. In general, the LTC6404 will settle much
more quickly from these periodic load impulses than
from a 2V input step, but it is a good idea to either use
the fi ltered outputs to drive the ADC (Figure 11 shows an
example of this), or to place a discrete R-C fi lter network
between the differential unfi ltered outputs of the LTC6404
and the input of the ADC to help absorb the charge transfer
required during the ADC sampling process. The capaci-
tance of the fi lter network serves as a charge reservoir
to provide high frequency charging during the sampling
process, while the two resistors of the fi lter network are
used to dampen and attenuate any charge kickback from
the ADC. The selection of the R-C time constant is trial
and error for a given ADC, but the following guidelines
are recommended: Choosing too large of a resistor in the
decoupling network (leaving insuffi cient settling time)
+
1
SHDN
5 6
IN
7
OUT
+
8
OUTF
+
16 15
IN
+
NC
NC
14
OUT
13
OUTF
AIN
+
AIN
100
2
V
+
3
V
V
+
V
+
V
3.3V
V
OCM
V
OCM
12
V
11
V
+
10
V
+
9
V
V
V
6404 F11
LTC6404-1
LTC2207
V
IN
2V
P-P
SHDN
100
100
100
0.1µF
3.3V
4
0.1µF
0.1µF
CONTROL
GND
V
DD
D15
D0
0.1µF
V
CM
2.2µF
3.3V
F F
LTC6404
27
6404f
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
PACKAGE DESCRIPTION
UD Package
16-Lead Plastic QFN (3mm × 3mm)
(Reference LTC DWG # 05-08-1691)
will create a voltage divider between the dynamic input
impedance of the ADC and the decoupling resistors.
Choosing too small of a resistor will possibly prevent the
resistor from properly damping the load transient caused
by the sampling process, prolonging the time required for
APPLICATIONS INFORMATION
settling. 16-bit applications typically require a minimum
of 11 R-C time constants. It is recommended that the ca-
pacitor chosen have a high quality dielectric (for example,
C0G multilayer ceramic).
3.00 ± 0.10
(4 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
1.45 ± 0.05
(4 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
ON THE TOP AND BOTTOM OF PACKAGE
PIN 1
TOP MARK
(NOTE 6)
0.40 ± 0.10
BOTTOM VIEW—EXPOSED PAD
1.45 ± 0.10
(4-SIDES)
0.75 ± 0.05
R = 0.115
TYP
0.25 ± 0.05
1
PIN 1 NOTCH R = 0.20 TYP
OR 0.25 × 45° CHAMFER
15 16
2
0.50 BSC
0.200 REF
2.10 ± 0.05
3.50 ± 0.05
0.70 ±0.05
0.00 – 0.05
(UD16) QFN 0904
0.25 ±0.05
0.50 BSC
PACKAGE OUTLINE

LTC6404IUD-1#PBF

Mfr. #:
Manufacturer:
Analog Devices Inc.
Description:
High Speed Operational Amplifiers 600MHz low noise differential ADC driver
Lifecycle:
New from this manufacturer.
Delivery:
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