AOZ1024D
Rev. 1.3 September 2009 www.aosmd.com Page 10 of 16
In a buck converter, output capacitor current is continu-
ous. The RMS current of output capacitor is decided by
the peak to peak inductor ripple current. It can be
calculated by:
Usually, the ripple current rating of the output capacitor is
a smaller issue because of the low current stress. When
the buck inductor is selected to be very small and induc-
tor ripple current is high, output capacitor could be over-
stressed.
Loop Compensation
The AOZ1024D employs peak current mode control for
easy use and fast transient response. Peak current mode
control eliminates the double pole effect of the output
L&C filter. It greatly simplifies the compensation loop
design.
With peak current mode control, the buck power stage
can be simplified to be a one-pole and one-zero system
in frequency domain. The pole is dominant pole can be
calculated by:
The zero is a ESR zero due to output capacitor and its
ESR. It is can be calculated by:
where;
C
O
is the output filter capacitor,
R
L
is load resistor value, and
ESR
CO
is the equivalent series resistance of output capacitor.
The compensation design is actually to shape the
converter control loop transfer function to get desired
gain and phase. Several different types of compensation
network can be used for the AOZ1024D. For most cases,
a series capacitor and resistor network connected to the
COMP pin sets the pole-zero and is adequate for a stable
high-bandwidth control loop.
In the AOZ1024D, FB pin and COMP pin are the invert-
ing input and the output of internal error amplifier. A
series
R and C compensation network connected to COMP
provides one pole and one zero. The pole is:
where;
G
EA
is the error amplifier transconductance, which is 200 x 10
-6
A/V,
G
VEA
is the error amplifier voltage gain, which is 500 V/V, and
C
2
is compensation capacitor in Figure 1.
The zero given by the external compensation network,
capacitor C
2
and resistor R
3
, is located at:
To design the compensation circuit, a target crossover
frequency f
C
for close loop must be selected. The system
crossover frequency is where control loop has unity gain.
The crossover is the also called the converter bandwidth.
Generally a higher bandwidth means faster response to
load transient. However, the bandwidth should not be too
high because of system stability concern. When design-
ing the compensation loop, converter stability under all
line and load condition must be considered.
Usually, it is recommended to set the bandwidth to be
equal or less than 1/10 of switching frequency. The
AOZ1024D operates at a frequency range from 350kHz
to 600kHz. It is recommended to choose a crossover
frequency equal or less than 40kHz.
The strategy for choosing R
C
and CC is to set the cross
over frequency with R
C
and set the compensator zero
with C
C
. Using selected crossover frequency, f
C
, to
calculate R
3
:
where;
f
C
is the desired crossover frequency. For best performance, f
C
is set to be about 1/10 of the switching frequency;
V
FB
is 0.8V,
G
EA
is the error amplifier transconductance, which is 200 x 10
-6
A/V, and
G
CS
is the current sense circuit transconductance, which is 6.68
A/V.
The compensation capacitor C
C
and resistor R
C
together
make a zero. This zero is put somewhere close to the
I
CO_RMS
ΔI
L
12
----------
=
f
P1
1
2π
C
O
R
L
××
-----------------------------------
=
f
Z1
1
2π C
O
ESR
CO
××
------------------------------------------------
=
f
P2
G
EA
2π C
2
G
VEA
××
------------------------------------------
=
f
Z2
1
2π C
C
R
C
××
-----------------------------------
=
f
C
40kHz=
R
C
f
C
V
O
V
FB
----------
2π C
2
×
G
EA
G
CS
×
----------------------------- -
××=
Not Recommended For New Designs
AOZ1024D
Rev. 1.3 September 2009 www.aosmd.com Page 11 of 16
dominate pole f
p1
but lower than 1/5 of selected cross-
over frequency. C
2
can is selected by:
The previous equation can also be simplified to:
An easy-to-use application software which helps to
design and simulate the compensation loop can be found
at www.aosmd.com
.
Thermal Management and Layout
Consideration
In the AOZ1024D buck regulator circuit, high pulsing
current flows through two circuit loops. The first loop
starts from the input capacitors, to the V
IN
pin, to the
LX pins, to the filter inductor, to the output capacitor
and load, and then return to the input capacitor through
ground. Current flows in the first loop when the high side
switch is on. The second loop starts from inductor, to the
output capacitors and load, to the low-side NMOSFET.
Current flows in the second loop when the low-side
NMOSFET is on.
In PCB layout, minimizing the two loops area reduces the
noise of this circuit and improves efficiency. A ground
plane is strongly recommended to connect input capaci-
tor, output capacitor, and PGND pin of the AOZ1024D.
In the AOZ1024D buck regulator circuit, the major power
dissipating components are the AOZ1024D and the
output inductor. The total power dissipation of converter
circuit can be measured by input power – output power.
The power dissipation of the inductor can be
approximately calculated by output current and DCR
of inductor.
The actual junction temperature can be calculated with
power dissipation in the AOZ1024D and thermal
impedance from junction to ambient.
The maximum junction temperature of AOZ1024D is
150°C, which limits the maximum load current capability.
Please see the thermal de-rating curves for maximum
load current of the AOZ1024D under different ambient
temperature.
The thermal performance of the AOZ1024D is strongly
affected by the PCB layout. Extra care should be taken
by users during design process to ensure that the IC
will operate under the recommended environmental
conditions.
The AOZ1024D is standard DFN5*4 package. Several
layout tips are listed below for the best electric and
thermal performance. Figure 3 on the next page
illustrates a PCB layout example of AOZ1024D.
1. The LX pins are connected to internal PFET and
NFET drains. They are low resistance thermal
conduction path and most noisy switching node.
Connected a large copper plane to LX pin to help
thermal dissipation. For full load (4A) application,
also connect the LX pads to the bottom layer by
thermal vias to enhance the thermal dissipation.
2. Do not use thermal relief connection to the V
IN
and
the PGND pin. Pour a maximized copper area to
the PGND pin and the VIN pin to help thermal
dissipation.
3. Input capacitor should be connected to the V
IN
pin
and the PGND pin as close as possible.
4. A ground plane is preferred. If a ground plane is
not used, separate PGND from AGND and connect
them only at one point to avoid the PGND pin noise
coupling to the AGND pin.
5. Make the current trace from LX pins to L to C
O
to the
PGND as short as possible.
6. Pour copper plane on all unused board area and
connect it to stable DC nodes, like V
IN
, GND or V
OUT
.
7. Keep sensitive signal trace far away form the LX
pins.
C
C
1.5
2π R
C
f
P1
××
-----------------------------------
=
C
C
C
O
R
L
×
R
C
---------------------
=
P
total
V
IN
I
IN
V
O
I
O
××=
P
inductor
I
O
2
R
inductor
1.1××=
T
junction
P
total
P
inductor_loss
()Θ
JA
×=
Not Recommended For New Designs
AOZ1024D
Rev. 1.3 September 2009 www.aosmd.com Page 12 of 16
Figure 3. AOZ1024D (DFN 5x4) PCB Layout
Thermal Vias
Bottom Layer
Thermal Dissipation
Not Recommended For New Designs

AOZ1024DI

Mfr. #:
Manufacturer:
Description:
IC REG BUCK ADJUSTABLE 4A 8DFN
Lifecycle:
New from this manufacturer.
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