MPXC2011DT1 Datasheet MPXC2011DT1 | P1-P3

Freescale reserves the right to change the detail specifications as may be required to permit

improvements in the design of its products.

Freescale Semiconductor Document Number: MPXC2011DT1

Data Sheet: Technical Data Rev. 11, 09/2015

MPXC2011DT1, 0 to 10 kPa,

Differential, Compensated Pressure

Sensor

Freescale Semiconductor has developed a high volume, miniature pressure

sensor package which is ideal as a sub-module component or a disposable unit.

The unique concept of the Chip Pak allows great flexibility in system design while

providing an economic solution for the designer. This new chip carrier package

uses Freescale Semiconductor's unique sensor die with its piezoresistive

technology, along with the added feature of on-chip, thin-film temperature

compensation and calibration.

Features

• Integrated temperature compensation and calibration

• Ratiometric to supply voltage

• Polysulfone case material (ISO 10993)

• Provided in easy-to-use tape and reel

Typical applications

• Respiratory diagnostics

• Air movement control

• Controllers

• Pressure switching

NOTE

The die and wire bonds are exposed on the front side of the chip

pak (pressure is applied to the backside of the device). Front

side die and wire protection must be provided in the customer's

housing. Use caution when handling the devices during all

processes.

Ordering Information

Device Name Shipping Package

Pressure Type

Device Marking

Gauge Differential Absolute

MPXC2011DTI

Tape and Reel 98ASB13355C •

XXXX = Device code

XXX = Trace code

1234

GND

OUT

–V

OUT

MPXC2011DT1

Chip Pak package

Back view

MPXC2011DT1

Case 98ASB13355C

Front view

Pinout

MPXC2011DT1

Sensors

2 Freescale Semiconductor, Inc.

Related Documentation

The MPXC2011DT1 device features and operations are described in a variety of reference manuals, user guides, and application

notes. To find the most-current versions of these documents:

1. Go to the Freescale homepage at:

http://www.freescale.com/

2. In the Keyword search box at the top of the page, enter the device number MPXC2011DT1.

3. In the Refine Your Result pane on the left, click on the Documentation link.

Contents

1 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

3 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

3.1 Package description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

4 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

MPXC2011DT1

Sensors

Freescale Semiconductor, Inc. 3

1 General Description

Freescale Semiconductor's MPXC2011DT1 Pressure Sensor has been designed for medical usage by combining the

performance of Freescale Semiconductor's shear stress pressure sensor design and the use of biomedically approved materials.

Materials with a proven history in medical situations have been chosen to provide a sensor that can be used with confidence in

applications, such as invasive blood pressure monitoring. It can be sterilized using ethylene oxide. The portions of the pressure

sensor that are required to be biomedically approved are the rigid housing and the gel coating.

The rigid housing is molded from a white, medical grade polysulfone that has passed extensive biological testing including: ISO

10993-5:1999, ISO 10993-10:2002, and ISO 10993-11:1993.

The MPXC2011DT1 contains a silicone dielectric gel which covers the silicon piezoresistive sensing element. The gel is a

nontoxic, nonallergenic elastomer system which meets all USP XX Biological Testing Class V requirements. The properties of

the gel allow it to transmit pressure uniformly to the diaphragm surface, while isolating the internal electrical connections from the

corrosive effects of fluids, such as saline solution. The gel provides electrical isolation sufficient to withstand defibrillation testing,

as specified in the proposed Association for the Advancement of Medical Instrumentation (AAMI) Standard for blood pressure

transducers. A biomedically approved opaque filler in the gel prevents bright operating room lights from affecting the performance

of the sensor.

1.1 Block diagram

Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.

Figure 1. Block diagram

1.2 Pinout

Figure 2. Device pinout (front view)

Table 1. Pin functions

Pin Name Function

1 GND Ground

2+V

OUT

Output voltage

3+V

Voltage supply

4–V

OUT

Output voltage

OUT

–V

OUT

Sensing

Element

GND

Thin Film

Temperature

Compensation

and Calibration

Circuitry

1234

GND

OUT

–V

OUT

P1-P3 P4-P6 P7-P7

MPXC2011DT1

Mfr. #:

Buy MPXC2011DT1

Manufacturer:

NXP / Freescale

Description:

Board Mount Pressure Sensors CHIP PAK 1/3 GEL FILL

Lifecycle:

New from this manufacturer.

Delivery:

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Products related to this Datasheet

MPXC2011DT1