MPXC2011DT1

MPXC2011DT1
Sensors
4 Freescale Semiconductor, Inc.
2 Mechanical and Electrical Specifications
2.1 Maximum ratings
2.2 Operating characteristics
Table 2. Maximum ratings
(1)
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Rating Symbol Value Unit
Maximum pressure (backside) P
max
75 kPa
Storage temperature T
stg
-25 to +85 °C
Operating temperature T
A
+15 to +40 °C
Table 3. Operating characteristics (V
S
= 10 V
DC
, T
A
= 25 °C unless otherwise noted, P1 > P2)
Characteristic Symbol Min Typ Max Unit
Pressure range
(1)
1. 1.0 kPa (kilo Pascal) equals 0.145 psi.
P
OP
0—10kPa
Supply voltage
(2)
2. Device is ratiometric within this specified excitation range. Operating the device above the specified excitation range may induce additional
error due to device self-heating.
V
S
—310V
DC
Supply current I
O
—6.0—mAdc
Full-scale span
(3)
3. Full-scale span (V
FSS
) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
V
FSS
24 25 26 mV
Offset
(4)
4. Offset (V
OFF
) is defined as the output voltage at the minimum rated pressure.
V
OFF
-1.0 1.0 mV
Sensitivity ΔV/ΔP— 2.5 mV/kPa
Linearity
(5)
5. Accuracy (error budget) consists of the following:
Linearity: Output deviation from a straight line relationship with pressure, using end point method, over the specified
pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure, at 25 °C.
TcSpan: Output deviation at full rated pressure over the temperature range of 0 to 85 °C, relative to 25 °C.
TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 to 85 °C, relative to 25 °C.
—-1.0—1.0%V
FSS
Pressure hysteresis
(5)
(0 to 10 kPa)
——± 0.1 %V
FSS
Temperature hysteresis
(5)
(+15 °C to +40 °C)
——± 0.1 %V
FSS
Temperature effect on full-scale span
(5)
TCV
FSS
-1.0 1.0 %V
FSS
Temperature effect on offset
(5)
TCV
OFF
-1.0 1.0 mV
Input impedance Z
IN
1300 2550 Ω
Output impedance Z
OUT
1400 3000 Ω
Response time
(6)
(10% to 90%)
6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
t
R
—1.0—ms
Warm-up 20 ms
Offset stability
(7)
7. Offset stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
——± 0.5 %V
FSS
MPXC2011DT1
Sensors
Freescale Semiconductor, Inc. 5
3 Package Dimensions
3.1 Package description
This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB13355C.pdf.
Case 98ASB1335C, Chip Pak package
DIM
A
MIN MAX MIN MAX
MILLIMETERS
6.10 6.600.240 0.260
INCHES
B 8.89 9.400.350 0.370
C 3.56 3.810.140 0.150
D1 0.30 0.510.012 0.020
E 2.24 2.590.088 0.102
F 3.12 3.250.123 0.128
G 1.14 1.400.045 0.055
H 0.94 1.190.037 0.047
J 0.18 0.280.007 0.011
K 3.05 3.560.120 0.140
L 2.41 2.670.095 0.105
M 4.19 4.450.165 0.175
N 5.66 6.070.223 0.239
V 2.67 2.920.105 0.115
AA 2.41 2.720.095 0.107
AB 0.38 0.890.015 0.035
AC 3.05 4.450.120 0.175
AD 2.54 2.920.100 0.115
NOTES:
3. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
4. CONTROLLING DIMENSION: INCH.
AB
AD
AA
F
AC
BACK VIEW
G
D1
V
N
FRONT VIEW
M
A
12 43
C
L
B
F
K
H
E
J
–T–
END VIEW
D2
DETAIL A
DETAIL A
D2 0.36 0.560.014 0.022
1.
2.
MPXC2011DT1
Sensors
6 Freescale Semiconductor, Inc.
4 Revision History
Table 4. Revision history
Revision
number
Revision
date
Description
9 10/2012
Deleted references to device number MPXC2012DT (a no-gel option) throughout the document.
10 08/2014
Added pin descriptions and pin numbers.
11 09/2015
Corrected Block Diagram.
Updated format.

MPXC2011DT1

Mfr. #:
Manufacturer:
NXP / Freescale
Description:
Board Mount Pressure Sensors CHIP PAK 1/3 GEL FILL
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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