ADA4412-3ARQZ-RL Datasheet ADA4412-3ARQZ, ADA4412-3ARQZ-R7, ADA4412-3ARQZ-RL | P4-P6

ADA4412-3

Rev. 0 | Page 3 of 16

SPECIFICATIONS

= 5 V, @ T

= 25°C, V

= 1.4 V p-p, R

= 150 Ω, unless otherwise noted.

Table 1.

Parameter Test Conditions/Comments Min Typ Max Unit

OVERALL PERFORMANCE

Offset Error Input referred, all channels 9 23 mV

Offset Adjust Range Input referred ±500 mV

Input Voltage Range, All Inputs V

S−

− 0.1 V

S+

− 2.0 V

Output Voltage Swing, All Outputs Positive swing V

S+

− 0.30 V

S+

− 0.20 V

Negative swing V

S−

+ 0.10 V

S−

+ 0.15 V

Linear Output Current per Channel 30 mA

Integrated Voltage Noise, Referred to Input All channels 0.50 mV rms

Filter Input Bias Current All channels 6.6 μA

Total Harmonic Distortion at 1 MHz F

= 36 MHz, F

= 18 MHz/F

= 9 MHz 0.01/0.04 %

Gain Error Magnitude 0.09 0.49 dB

FILTER DYNAMIC PERFORMANCE

−1 dB Bandwidth Cutoff frequency select = 36 MHz 26.5 31.5 MHz

Cutoff frequency select = 18 MHz 13.5 15.5 MHz

Cutoff frequency select = 9 MHz 6.5 8.0 MHz

−3 dB Bandwidth Cutoff frequency select = 36 MHz 34 37 MHz

Cutoff frequency select = 18 MHz 16 19 MHz

Cutoff frequency select = 9 MHz 8 9 MHz

Out-of-Band Rejection f = 75 MHz −31 −43 dB

Crosstalk f = 5 MHz, F

= 36 MHz −62 dB

Propagation Delay f = 5 MHz, F

= 36 MHz 19 ns

Group Delay Variation Cutoff frequency select = 36 MHz 7 ns

Cutoff frequency select = 18 MHz 14 ns

Cutoff frequency select = 9 MHz 27 ns

Differential Gain NTSC, F

= 9 MHz 0.16 %

Differential Phase NTSC, F

= 9 MHz 0.05 Degrees

CUTOFF CONTROL INPUT PERFORMANCE

Input Logic 0 Voltage 0.8 V

Input Logic 1 Voltage 2.0 V

Input Bias Current 10 15 μA

DISABLE PERFORMANCE

DISABLE Assert Voltage V

S+

− 0.5 V

DISABLE Assert Time 100 ns

DISABLE Deassert Time 130 ns

DISABLE Input Bias Current 12 μA

Input-to-Output Isolation—Disabled f = 10 MHz 90 dB

POWER SUPPLY

Operating Range 4.5 12 V

Quiescent Current 53 56 mA

Quiescent Current—Disabled 10 150 μA

PSRR, Positive Supply All channels 64 70 dB

PSRR, Negative Supply All channels 58 60 dB

ADA4412-3

Rev. 0 | Page 4 of 16

= ±5 V, @ T

= 25°C, V

= 1.4 V p-p, R

= 150 Ω, unless otherwise noted.

Table 2.

Parameter Test Conditions/Comments Min Typ Max Unit

OVERALL PERFORMANCE

Offset Error Input referred, all channels 10 25 mV

Offset Adjust Range Input referred ±500 mV

Input Voltage Range, All Inputs V

S−

− 0.1 V

S+

− 2.0 V

Output Voltage Swing, All Outputs Positive swing V

S+

− 0.33 V

S+

− 0.24 V

Negative swing V

S−

+ 0.24 V

S−

+ 0.33 V

Linear Output Current per Channel 30 mA

Integrated Voltage Noise, Referred to Input All channels 0.50 mV rms

Filter Input Bias Current All channels 6.3 μA

Total Harmonic Distortion at 1 MHz F

= 36 MHz, F

= 18 MHz/F

= 9 MHz 0.01/0.03 %

Gain Error Magnitude 0.04 0.50 dB

FILTER DYNAMIC PERFORMANCE

−1 dB Bandwidth Cutoff frequency select = 36 MHz 30.0 MHz

Cutoff frequency select = 18 MHz 15.5 MHz

Cutoff frequency select = 9 MHz 8.0 MHz

−3 dB Bandwidth Cutoff frequency select = 36 MHz 34 36 MHz

Cutoff frequency select = 18 MHz 17 19 MHz

Cutoff frequency select = 9 MHz 8 9 MHz

Out-of-Band Rejection f = 75 MHz −31 −42 dB

Crosstalk f = 5 MHz, F

= 36 MHz −62 dB

Propagation Delay f = 5 MHz, F

= 36 MHz 19 ns

Group Delay Variation Cutoff frequency select = 36 MHz 7 ns

Cutoff frequency select = 18 MHz 12 ns

Cutoff frequency select = 9 MHz 24 ns

Differential Gain NTSC, F

= 9 MHz 0.04 %

Differential Phase NTSC, F

= 9 MHz 0.16 Degrees

CUTOFF CONTROL INPUT PERFORMANCE

Input Logic 0 Voltage 0.8 V

Input Logic 1 Voltage 2.0 V

Input Bias Current 10 15 μA

DISABLE PERFORMANCE

DISABLE Assert Voltage V

S+

− 0.5 V

DISABLE Assert Time 75 ns

DISABLE Deassert Time 125 ns

DISABLE Input Bias Current 35 μA

Input-to-Output Isolation—Disabled f = 10 MHz 90 dB

POWER SUPPLY

Operating Range 4.5 12 V

Quiescent Current 57 60 mA

Quiescent Current—Disabled 10 150 μA

PSRR, Positive Supply All channels 66 74 dB

PSRR, Negative Supply All channels 59 62 dB

ADA4412-3

Rev. 0 | Page 5 of 16

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter Rating

Supply Voltage 12 V

Power Dissipation See Figure 2

Storage Temperature –65°C to +125°C

Operating Temperature Range –40°C to +85°C

Lead Temperature Range (Soldering 10 sec) 300°C

Junction Temperature 150°C

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL RESISTANCE

is specified for the worst-case conditions, that is, θ

specified for device soldered in circuit board for surface-mount

packages.

Table 4. Thermal Resistance

Package Type θ

Unit

20-Lead QSOP 83 °C/W

Maximum Power Dissipation

The maximum safe power dissipation in the ADA4412-3

package is limited by the associated rise in junction temperature

) on the die. At approximately 150°C, which is the glass

transition temperature, the plastic changes its properties.

Even temporarily exceeding this temperature limit may change

the stresses that the package exerts on the die, permanently

shifting the parametric performance of the ADA4412-3.

Exceeding a junction temperature of 150°C for an extended

period can result in changes in the silicon devices potentially

causing failure.

The power dissipated in the package (P

) is the sum of the

quiescent power dissipation and the power dissipated in the

package due to the load drive for all outputs. The quiescent

power is the voltage between the supply pins (V

) times the

quiescent current (I

). The power dissipated due to load drive

depends on the particular application. For each output, the

power due to load drive is calculated by multiplying the load

current by the associated voltage drop across the device. The

power dissipated due to all of the loads is equal to the sum of

the power dissipations due to each individual load. RMS

voltages and currents must be used in these calculations.

Airflow increases heat dissipation, effectively reducing θ

In addition, more metal directly in contact with the package

leads from metal traces, through-holes, ground, and power

planes reduces the θ

Figure 2 shows the maximum safe power dissipation in the

package vs. the ambient temperature for the 20-lead QSOP

(83°C/W) on a JEDEC standard 4-layer board. θ

values are

approximations.

05528-002

AMBIENT TEMPERATURE (°C)

WATTS

–40 –20 0 20 40 60

0.5

0.7

0.9

1.1

1.3

1.5

1.7

1.9

2.1

2.3

2.5

Figure 2. Maximum Power Dissipation vs. Temperature for a 4-Layer Board

ESD CAUTION

ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on

the human body and test equipment and can discharge without detection. Although this product features

proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high energy

electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance

degradation or loss of functionality.

P1-P3 P4-P6 P7-P9 P10-P12 P13-P15 P16-P17

ADA4412-3ARQZ-RL

Mfr. #:

Buy ADA4412-3ARQZ-RL

Manufacturer:

Analog Devices Inc.

Description:

Video ICs Intg Triple Video Filter

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ADA4412-3ARQZ-RL

ADA4412-3ARQZ-RL

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