XR18W753
5
REV. 1.0.0 SINGLE CHIP 868MHZ TO 956MHZ RF TRANSCEIVER
Pin type: I=Input, O=Output, I/O= Input/output, OD=Output Open Drain.
TEST2 31 Digital I
Factory Test Mode. For normal operation, this pin should be connected
to GND.
A2 32 Digital I
I2C Address bit-2
A3 33 Digital I
I2C Address bit-3. This address line should be connected to GND.
CLK_OUT+
CLK_OUT-
34
35
Digital O
Digital O
16 MHz LVDS digital clock outputs. Connect pin 35 to ground for
CMOS clock output.
MODEM_RESET 36 Digital I
Digital modem reset (active high, level sensitive).
VREG_CLK_EN 37 Digital I
Voltage Regulator and crystal oscillator enable (active high, level sensi-
tive)
AVDD19 38 Power I
VDD (1.9V ± 0.1V) for crystal oscillator and clock divider.
XTAL1 39 Analog I
16MHz crystal input or external clock input. Based on typical PCB stray
capacitance, a 27 pF capacitor to GND is recommended.
XTAL2 40 Analog I
Crystal output, 27 pF capacitor to GND is recommended. If an external
clock is used at XTAL1, this input should be left unconnected.
AGND 41 Ground
Ground for crystal oscillator and buffers.
DVDD_OUT 42 Power O
Decoupling pin for digital VDD, 10 nF capacitor to GND recommended.
DVDD 43 Power I
Digital Power Supply, DVDD = 2.2 - 3.6V. DVDD and AVDD should use
the same power supply. 100nF capacitor to GND recommended.
AVDD 44 Power I
Analog Power Supply, AVDD = 2.2 - 3.6V. DVDD and AVDD should use
the same power supply. 100nF capacitor to GND recommended.
AVDD_OUT 45 Power O
1.9V stabilized analog VDD output. This output should be connected to
all AVDD19 pins. 1uF ceramic capacitor to GND recommended.
AVDD19 46 Power I
Analog VDD (1.9V ± 0.1V) for ADC and DAC.
AVDD19 47 Power I
Analog VDD (1.9V ± 0.1V) for ADC.
AVDD19 48 Power I
Analog VDD (1.9V ± 0.1V) for IF strip, TX mixers and both I/Q dividers.
PADDLE 49 Ground
The center pad on the backside of the 48-QFN package is metallic and
is not electrically connected to anything inside the device. It must be
soldered on to the PCB and may be optionally connected to GND on the
PCB. The thermal pad size on the PCB should be the approximate size
of this center pad and should be solder mask defined. The solder mask
opening should be at least 0.0025" inwards from the edge of the PCB
thermal pad.
N
AME PIN TYPE DESCRIPTION
