NCV8843
http://onsemi.com
14
PACKAGE DIMENSIONS
SOIC−16 WIDE BODY EXPOSED PAD
CASE 751AG−01
ISSUE A
G
−W−
−U−
P
M
0.25 (0.010) W
−T−
SEATING
PLANE
K
D 16 PL
C
M
0.25 (0.010) T UW
S S
M
F
DETAIL E
DETAIL E
R x 45
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER
SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION SHALL BE
0.13 (0.005) TOTAL IN EXCESS OF THE D DIMENSION
AT MAXIMUM MATERIAL CONDITION.
6. 751R-01 OBSOLETE, NEW STANDARD 751R-02.
J
M
14 PL
PIN 1 I.D.
8
1
16 9
TOP SIDE
0.10 (0.004) T
16
EXPOSED PAD
18
BACK SIDE
L
H
DIM
A
MIN MAX MIN MAX
INCHES
10.15 10.45 0.400 0.411
MILLIMETERS
B 7.40 7.60 0.292 0.299
C 2.35 2.65 0.093 0.104
D 0.35 0.49 0.014 0.019
F 0.50 0.90 0.020 0.035
G 1.27 BSC 0.050 BSC
H 3.45 3.66 0.136 0.144
J 0.25 0.32 0.010 0.012
K 0.00 0.10 0.000 0.004
L 4.72 4.93 0.186 0.194
M 0 7 0 7
P 10.05 10.55 0.395 0.415
R 0.25 0.75 0.010 0.029
____
A
B
9
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.350
0.175
0.050
0.376
0.188
0.200
0.074
DIMENSIONS: INCHES
0.024
0.150
Exposed
Pad
C
L
C
L
