2014 Microchip Technology Inc. DS20005139E-page 19
SST25WF020A
6.1 Power-Up Specifications
All functionalities and DC specifications are specified
for a V
DD
ramp rate of greater than 1V per 100 ms (0V
to 1.8V in less than 180 ms). See Table 6-3 and Figure
for more information.
FIGURE 6-1: POWER-UP TIMING DIAGRAM
TABLE 6-3: RECOMMENDED SYSTEM POWER-UP TIMINGS
Symbol Parameter Minimum Units
T
PU-READ
1
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
V
DD
Min to Read Operation 100 μs
T
PU-WRITE
1
V
DD
Min to Write Operation 100 μs
Time
V
DD
Min
V
DD
Max
V
DD
Device fully accessible
T
PU-READ
T
PU-WRITE
Chip selection is not allowed.
Commands may not be accepted or properly
interpreted by the device.
2513 F27.0
SST25WF020A
DS20005139E-page 20 2014 Microchip Technology Inc.
6.2 Hardware Data Protection
SST25WF020A provides a power-up reset function. To
ensure that the power reset circuit will operate cor-
rectly, the device must meet the conditions shown in
Figure and Table 6-4. Microchip does not guarantee
the data in the event of an instantaneous power failure
that occurs during a Write operation.
FIGURE 6-2: POWER-DOWN TIMING DIAGRAM
6.3 Software Data Protection
SST25WF020A prevents unintentional operations by
not recognizing commands under the following condi-
tions:
After inputting a Write command, if the rising CE#
edge timing is not in a bus cycle (8 CLK units of
SCK)
When the Page-Program data is not in 1-byte
increments
If the Write Status Register instruction is input for
two bus cycles or more.
6.4 Decoupling Capacitor
A 0.1μF ceramic capacitor must be provided to each
device and connected between V
DD
and V
SS
to ensure
that the device will operate correctly.
TABLE 6-4: RECOMMENDED SYSTEM POWER-DOWN TIMINGS
Symbol Parameter Min Max Units
T
PD
Power-down time 10 ms
V
BOT
Power-down voltage 0.2 V
T
PD
V
DD
Min
V
DD
Max
V
DD
25139 F48.0
0V
V
BOT
2014 Microchip Technology Inc. DS20005139E-page 21
SST25WF020A
6.5 DC Characteristics
TABLE 6-5: DC OPERATING CHARACTERISTICS
Symbol Parameter
Limits
Test ConditionsMin Typ
1
1. Value characterized, not fully tested in production.
Max Units
I
DDR
Read Current 6 mA CE#=0.1 V
DD
/0.9 V
DD
@25 MHz,
SO=open
I
DDR2
Read Current 8 mA CE#=0.1 V
DD
/0.9V
DD
@40 MHz,
SO=open
I
DDW
Program and Erase Current 15 mA CE#=V
DD
I
SB
Standby Current 50 μA CE#=V
DD
, V
IN
=V
DD
or V
SS
I
DPD
Deep Power-Down 10 μA CE#=V
DD
, V
IN
=V
DD
or V
SS
I
LI
Input Leakage Current 2 μAV
IN
=GND to V
DD
, V
DD
=V
DD
Max
I
LO
Output Leakage Current 2 μAV
OUT
=GND to V
DD
, V
DD
=V
DD
Max
V
IL
Input Low Voltage -0.3 0.3 V V
DD
=V
DD
Min
V
IH
Input High Voltage 0.7 V
DD
V
DD
+0.3 V V
DD
=V
DD
Max
V
OL
Output Low Voltage 0.2 V I
OL
=100 μA, V
DD
=V
DD
Min
V
OH
Output High Voltage V
DD
-0.2 V I
OH
=-100 μA, V
DD
=V
DD
Min
TABLE 6-6: CAPACITANCE (T
A
= 25°C, F=1 MHZ, OTHER PINS OPEN)
Parameter Description Test Condition Maximum
C
OUT
1
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
Output Pin Capacitance V
OUT
= 0V 12 pF
C
IN
1
Input Capacitance V
IN
= 0V 6 pF
TABLE 6-7: RELIABILITY CHARACTERISTICS
Symbol Parameter Minimum Specification Units Test Method
N
END
1
1. This parameter is measured only for initial qualification and after a design or process change that could affect this parameter.
Endurance 100,000 Cycles JEDEC Standard A117
Status Register Write Cycle 100,000 Cycles JEDEC Standard A117
T
DR
1
Data Retention 20 Years JEDEC Standard A103
I
LTH
1
Latch Up 100 + I
DD
mA JEDEC Standard 78

SST25WF020AT-40I/NP

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Microchip Technology
Description:
NOR Flash 1.65V to 1.95V 2Mbit SPI Serial Flash
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