P82B715_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 9 November 2009 13 of 23
NXP Semiconductors
P82B715
I
2
C-bus extender
9. Limiting values
[1] Voltages with respect to GND.
The bus voltages quoted are DC voltages and are allowed to be exceeded during any negative transient
undershoot that may be generated by normal operation of P82B715, P82B96 or PCA9600 when any of
those parts are driving long PCB traces, wiring or cables. The Lx/Sx pins have internal protective diodes to
GND that will conduct when the applied bus voltage exceeds approximately 0.6 V and these diodes will
limit the amplitude of the negative undershoot. If required, fitting additional Schottky diodes such as
BAT54A at Sx/Sy may be used to further ensure any undershoot at these pins does not cause conduction of
the diodes inside other ICs connected to Sx/Sy.
10. Characteristics
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter Conditions Min Max Unit
V
CC
supply voltage
[1]
0.3 +12 V
V
bus
voltage range I
2
C-bus, SCL or SDA
[1]
0V
CC
V
V
buff
voltage range buffered bus
[1]
0V
CC
V
I DC current (any pin) - 60 mA
P
tot
total power dissipation - 300 mW
T
stg
storage temperature 55 +125 °C
T
amb
ambient temperature operating 40 +85 °C
Table 5. Characteristics
T
amb
=25
°
C; V
CC
= 5 V; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Power supply
V
CC
supply voltage operating
[1]
4.5 - 12 V
I
CC
supply current - 14 - mA
V
CC
=12V - 15 - mA
both I
2
C-bus inputs LOW; both
buffered outputs sinking 30 mA
-22-mA
Drive currents
I
Sx
, I
Sy
output sink on I
2
C-bus V
CC
>3V; V
Sx
,V
Sy
LOW = 0.4 V;
V
Lx
,V
Ly
LOW on buffered bus = 0.3 V;
I
Lx
, I
Ly
= 3mA
[2]
3- - mA
I
Lx
, I
Ly
output sink on buffered bus V
Lx
, V
Ly
LOW = 0.4 V;
V
Sx
,V
Sy
LOW on I
2
C-bus = 0.3 V
30 - - mA
Derated dynamic drive currents for V
CC
< 4.5 V
[1]
I
Lx
, I
Ly
output sink on buffered bus V
CC
>3V;
V
Lx
,V
Ly
LOW = 0.4 V to 1.5 V;
I
Sx
,I
Sy
sinking on I
2
C-bus < 4mA
24 - - mA
V
CC
>3V;
V
Lx
,V
Ly
LOW = 1.5 V to V
CC
;
I
Sx
,I
Sy
sinking on I
2
C-bus = 7mA
24 - - mA
P82B715_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 9 November 2009 14 of 23
NXP Semiconductors
P82B715
I
2
C-bus extender
[1] Operation with reduced performance is possible down to 3 V. Typical static sinking performance is not degraded at 3 V, but the dynamic
sink currents while the output is being driven through 0.5V
CC
are reduced and can increase fall times. Timing-critical designs should
accommodate the guaranteed minimums.
[2] Buffer is passive in this test. The Sx/Sy sink current flows via an internal resistor to the driver connected at the Lx/Ly I/O.
[3] A conventional input-output delay will not be observed in the Sx/Lx voltage waveforms because the input and output pins are internally
tied with a 30 resistor so they show equal logic voltage levels, to within 100 mV. When connected in an I
2
C-bus system, an Sx/Sy
input pin cannot rise/fall until the buffered bus load at the output pin has been driven by the internal amplifier. This test measures the bus
propagation delay caused to falling or rising voltages at the Lx/Ly output (as well as the Sx/Sy input) by the amplifier’s response time.
The figure given is measured with a drive current as shown in Figure 12. Because this is a dynamic bus test in which a corresponding
bus driving IC has an output voltage well above 0.4 V, 6 mA is used instead of the static 3 mA.
[4] The signal path Lx to Sx and Ly to Sy is passive via the internal 30 resistor. There is no amplifier involved and essentially no signal
propagation delay.
11. Test information
Input currents
I
Sx
, I
Sy
input current from I
2
C-bus I
Lx
, I
Ly
sink on buffered bus = 30 mA - - 3mA
I
Lx
, I
Ly
input current from buffered bus V
CC
>3V; I
Sx
, I
Sy
sink on
I
2
C-bus = 3 mA
[2]
--3mA
I
Lx
, I
Ly
leakage current on buffered bus V
CC
= 3 V to 12 V; V
Lx
, V
Ly
=V
CC
and
V
Sx
, V
Sy
=V
CC
- - 200 µA
Impedance transformation
Z
in
/Z
out
input/output impedance V
Sx
<V
Lx
and the buffer is active;
I
Lx
sinking 30 mA on buffered bus
81013
Buffer delay times
t
rise/fall delay
I
Sx
to V
Lx
I
Sy
to V
Ly
time delay to V
Lx
voltage
crossing 0.5V
CC
for input drive
current step I
Sx
at Sx
see
Figure 12; R
Lx
pull-up = 270 ;
no capacitive load; V
CC
=5V
[3]
- 250 - ns
t
rise/fall delay
V
Lx
to V
Sx
V
Ly
to V
Sy
buffer time delay of switching
edges between V
Lx
input and
V
Sx
output
R
Sx
pull-up = 4700 ;
no capacitive load; V
CC
=5V
[4]
-0-ns
Table 5. Characteristics
…continued
T
amb
=25
°
C; V
CC
= 5 V; unless otherwise specified.
Symbol Parameter Conditions Min Typ Max Unit
Fig 12. Test circuit for delay times
I = 6 mA
002aad693
P82B715
input
Sx Lx
4.7 k
5 V
270
P82B715
Lx Sx
4.7 k
V V V
input
current
t
delay
t
delay
0 V
5 V
input and
output
voltage
output
P82B715_8 © NXP B.V. 2009. All rights reserved.
Product data sheet Rev. 08 — 9 November 2009 15 of 23
NXP Semiconductors
P82B715
I
2
C-bus extender
12. Package outline
Fig 13. Package outline SOT97-1 (DIP8)
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC JEITA
SOT97-1
99-12-27
03-02-13
UNIT
A
max.
12
b
1
(1) (1)
(1)
b
2
cD E e M
Z
H
L
mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
min.
A
max.
b
max.
w
M
E
e
1
1.73
1.14
0.53
0.38
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
0.2542.54 7.62
8.25
7.80
10.0
8.3
1.154.2 0.51 3.2
inches
0.068
0.045
0.021
0.015
0.014
0.009
1.07
0.89
0.042
0.035
0.39
0.36
0.26
0.24
0.14
0.12
0.010.1 0.3
0.32
0.31
0.39
0.33
0.0450.17 0.02 0.13
b
2
050G01 MO-001 SC-504-8
M
H
c
(e )
1
M
E
A
L
seating plane
A
1
w M
b
1
e
D
A
2
Z
8
1
5
4
b
E
0 5 10 mm
scale
Note
1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
pin 1 index
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1

P82B715TD,118

Mfr. #:
Manufacturer:
NXP Semiconductors
Description:
Interface - Signal Buffers, Repeaters I2C BUS EXTENDER
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
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