NUD3112LT1

NUD3112
www.onsemi.com
4
TYPICAL PERFORMANCE CURVES (T
J
= 25°C unless otherwise specified)
Figure 2. Output Characteristics
1
0.1
0.01
0.001
0.0001
0.00001
0.0 0.1 0.2 0.3 0.4 0.5 0.6
1
0.1
0.01
0.001
0.0001
3.50.5 1.0 1.5 2.0 2.5
25°C
125°C
I
D
= 0.5 A
V
GS
= 3.0 V
1200
1000
600
200
0
50 25 25 75 1250
21
0.1 1 1000
4500
3500
2500
1500
500
0.6 0.8 1 1.2 1.4 1.6
125°C
3.0
800
400
V
DS
, DRAINTOSOURCE VOLTAGE (V)
V
GS
, GATETOSOURCE VOLTAGE (V)
I
D,
DRAIN CURRENT (A)
TEMPERATURE (°C)
I
Z
, ZENER CURRENT (mA)
V
GS
, GATETOSOURCE VOLTAGE (V)
Figure 3. Transfer Function
Figure 4. OnResistance Variation vs.
Temperature
Figure 5. R
DS(ON)
Variation vs. GatetoSource
Voltage
Figure 6. Zener Voltage vs. Temperature
Figure 7. Zener Clamp Voltage vs. Zener
Current
V
GS
= 3.0 V
V
GS
= 5.0 V
50 100
15.98
50 25 0 25 125
TEMPERATURE (°C)
I
Z
= 10 mA
10 100
25°C
0.7 0.8
V
GS
= 2.0 V
V
GS
= 1.5 V
V
GS
= 1.0 V
0.00001
4.0 4.5 5.0
85°C
40°C
I
D
= 0.25 A
V
GS
= 3.0 V
I
D
= 0.5 A
V
GS
= 5.0 V
40°C85°C 25°C
4000
3000
2000
1000
0
50 75 100
15.96
15.94
15.92
15.90
15.88
15.86
15.84
15.82
15.80
V
Z
, ZENER VOLTAGE (V)
V
Z
, ZENER CLAMP VOLTAGE (V)
20
19
18
17
16
15
14
13
40°C
85°C
I
D
= 250 mA
V
DS
= 0.8 V
I
D,
DRAIN CURRENT (A)
R
DS(on)
, DRAINTOSOURCE RESISTANCE (W)
R
DS(on)
, DRAINTOSOURCE RESISTANCE (mW)
NUD3112
www.onsemi.com
5
TYPICAL PERFORMANCE CURVES (T
J
= 25°C unless otherwise specified)
I
D
, DRAIN CURRENT (A)
0.4
1.2
0.05 0.10 0.15 0.20 0.30
125°C
0.35
Figure 8. OnResistance vs. Drain Current and
Temperature
Figure 9. Gate Leakage vs. Temperature
1.1
0.9
0.8
0.25
45
35
25
10
0
50 25 25 75 1250
30
15
TEMPERATURE (°C)
50 100
V
GS
= 3.0 V
V
GS
= 5.0 V
1
0.7
0.6
0.5
0.45 0.500.40
85°C
25°C
40°C
40
5
20
V
GS
= 3.0 V
R
DS(on)
, DRAINTOSOURCE RESISTANCE (W)
I
GSS
, GATE LEAKAGE (mA)
Figure 10. Typical Application Circuit
+12V
1.0 k
300 k
+5V / 3.3V
ESD Zener
Relay
ESD Zener
clamp Zener
clamp Zener
Logic
NUD3112
www.onsemi.com
6
PACKAGE DIMENSIONS
SOT23 (TO236)
CASE 31808
ISSUE AR
D
A1
3
1
2
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
SOLDERING FOOTPRINT*
VIEW C
L
0.25
L1
e
E
E
b
A
SEE VIEW C
DIM
A
MIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1
0.01 0.06 0.10 0.000
b 0.37 0.44 0.50 0.015
c 0.08 0.14 0.20 0.003
D 2.80 2.90 3.04 0.110
E 1.20 1.30 1.40 0.047
e 1.78 1.90 2.04 0.070
L
0.30 0.43 0.55 0.012
0.039 0.044
0.002 0.004
0.017 0.020
0.006 0.008
0.114 0.120
0.051 0.055
0.075 0.080
0.017 0.022
NOM MAX
L1
H
2.10 2.40 2.64 0.083 0.094 0.104
H
E
0.35 0.54 0.69 0.014 0.021 0.027
c
0 −−− 10 0 −−− 10
T
____
T
3X
TOP VIEW
SIDE VIEW
END VIEW
2.90
0.80
DIMENSIONS: MILLIMETERS
0.90
PITCH
3X
3X
0.95
RECOMMENDED
STYLE 21:
PIN 1. GATE
2. SOURCE
3. DRAIN
*For additional information on our PbFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.

NUD3112LT1

Mfr. #:
Manufacturer:
ON Semiconductor
Description:
MOSFET 12V Industrial Relay
Lifecycle:
New from this manufacturer.
Delivery:
DHL FedEx Ups TNT EMS
Payment:
T/T Paypal Visa MoneyGram Western Union